Electronics Forum | Mon Nov 01 11:07:36 EST 1999 | William
Thank you so much Dave for all of your wonderful help. You know, all I really wanted to know was a little more about the gold porosity problem. Since I am not an expert on gold immersion, nor do I claim to be, I just wanted some information so that
Electronics Forum | Thu Aug 09 12:53:59 EDT 2001 | seand
Hello everyone, First when defining any criteria for process control, one should identify quantiatively that criteria. Then one establishes an effective method for measuring such a criteria. Once you have a test method, your gateway to a solving y
Electronics Forum | Tue Dec 05 13:34:51 EST 2000 | NickMata
Hello all, at the present I have some product onto which I glue backside components. I dispense a pattern of "witness" to use as a visual cue as to the quality of the dispensed glue dots. A problem which I have encountered is that operators will oft
Electronics Forum | Mon Sep 11 14:15:28 EDT 2000 | Gary
I am looking for some details about the failure modes in popcorned components. Does the component usually fail to operate. Is the damage likely to extend to the gold bond, wires, or substrate. We have experienced a high failure rate on a subset of
Electronics Forum | Thu May 25 17:18:45 EDT 2000 | Boca
I have not done pin in paste in production quantites, but speculation is always a blast so; OA fluxes are active at room temperature, they grow 'fur' with humidity if not washed off, great stuff for soldering, nasty stuff for reliability (if not rem
Electronics Forum | Wed Dec 15 04:59:40 EST 1999 | Joshua Hall
Hello KA, When producing in kind of PCB product you have to base much of your decision on cost effectiveness, time, and quality. In order to get the best of all three you have to decide which you want to be your top priority. By adding an epoxy to
Electronics Forum | Sun Oct 17 03:36:55 EDT 1999 | Brian
Obviously, clean enough :-) I don't think I've ever seen a specification, although some companies obviously have in-house ones. It would depend on the process used. For ex., if you used Parylene, where the coating is done in a vacuum chamber, you wou
Electronics Forum | Sat Oct 09 03:45:34 EDT 1999 | Brian
| Right now,we have some problem on SMT. Cause of the flux residue | in the connector. Do somebody have the same symptom? By the way, | can i find something to make the flux observe easy or take a photo with the flux. | | | Unfortunately, this pr
Electronics Forum | Thu Sep 30 12:02:20 EDT 1999 | Wolfgang Busko
| I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | What is the best way to achi
Electronics Forum | Mon Mar 22 16:59:15 EST 1999 | B K
| Has any one seen failures of chip resistors after 1-2 years where the junction between the silver termination and the restive element on the top of the ceramic has corroded through. This results in a high resistance failure after this period of tim