Electronics Forum: exceed (Page 6 of 42)

Plasma Cleaning / Etching

Electronics Forum | Fri Sep 10 08:23:34 EDT 2010 | duso02

We have done it before prior to conformal coating a customer's populated board with parylene. They had us do a sample first then conducted testing. No ill effects but it really comes down to the components installed and what they can handle. The surf

IPC J STD 004B Reliability tests

Electronics Forum | Mon Dec 20 10:20:14 EST 2010 | 18424

Test Resistance to ECM shall be 65C +- 2C @ 88.5% +- 3.5% All SIR Measurements shall not exceed 100 MOhm. I am not sure of voltage.

Flaky Capacitor

Electronics Forum | Thu Jun 05 14:20:55 EDT 2014 | isd_jwendell

230C for max 30 sec.". Isn't 225C close enough to 230C, so that you are effectively exceeding mfg spec by 60 sec.?

Z4-axis The position error exceeded the limit

Electronics Forum | Tue May 18 10:35:11 EDT 2021 | kumarb

Hi. See this thread which may help you: https://smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=22839&#Message85508

Adhesive printing

Electronics Forum | Fri Feb 01 10:19:22 EST 2002 | cyber_wolf

Whoa! I beg to differ my friend. The cure profile is VERY critical in Adhesive curing, especially if your are screen printing. When you screen print adhesive you are leaving it exposed to the atmosphere for a period of time. SMT adhesive by nature i

CSP No clean residue

Electronics Forum | Thu Dec 23 03:05:26 EST 2004 | Steve Stach

The Jury is still out on no-clean reliability in the long term as no-clean didn't gain wide spread acceptance until the early 1990's. Also, in today's disposable society, few products are expected to last 15-20 years. Experience has shown that if y

Solderality problems with SN100C Lead Free Hasl

Electronics Forum | Wed Sep 27 23:52:28 EDT 2006 | fctassembly

Hello Steve, Yes, there are differences in the various alloys and I have described briefly below these differences: SN100- a common name for 100% tin that is used to increase the tin content in 63/37. SN100C-Name for Tin/Copper/Nickel/Germanium all

BGA Voids

Electronics Forum | Tue Feb 12 17:57:42 EST 2008 | chef

I must ask the silly question- are you sure you deposited the correct amount of paste? Depending on aperature design-the voiding could come from a stencil that has its holes partially built up with old paste. If paste volume is guaranteed, then what

J-STD-033B.1

Electronics Forum | Fri Apr 02 12:41:12 EDT 2010 | CL

Nicolas, 4.1.2.1 and 4.1.2.2 mention the requirements for drying an MSD to resett the clock life. 4.1.2.2 states that once a component is dried, refer to 5.3 for safe storage. Under that specification is 5.3.3.2 DRY Cabinet at 5% RH- This states tha

HASL alternatives

Electronics Forum | Wed Oct 18 09:44:38 EDT 2000 | mike weekes

we're considering PWB finishes other than HASL - the uneven plating contributed to defects and the residues exceed our goal for PWB cleanliness. What success have any of you had with CuOSP, Immersion Silver, Gold or other finishes? Did you have to


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