Electronics Forum: face (Page 6 of 70)

UltraSonic cleaning machine

Electronics Forum | Wed Sep 25 10:13:32 EDT 2002 | davef

I don't think 'this a blatant violation of rules' as such. I think it is a blantant disrespect of the principle of free and open communication that is the corner stone of interenet forums and a slap in the face of everyone that wants to learn more a

Component Lead Finish - Article in Japanese Can some body help ?

Electronics Forum | Thu Nov 21 09:02:54 EST 2002 | GSW

Thanks Steve, Its the same problem we are facing. I could read the data that was in english. I want to know what they have concluded in their summary. Are you a Contract Manufacturer or a OEM ? Thanks

SMT machines obsolescence

Electronics Forum | Thu Jun 26 14:03:26 EDT 2003 | cristiano

I am looking for information about SMT machines obsolescence face to new types of components packaging like BGA�s and flip chips 0201 chips and others. I want to begin a study about industry trends that will help us to define what kind of equipment

Dynapert VCD-G board spare

Electronics Forum | Thu Oct 23 10:28:00 EDT 2003 | lawrence

I owns a 1992 Dynapert VCD-G axial inserter, have face difficulty in locating Board level spare parts. Would appreciate help from your recommendation.

screen printer from MPM

Electronics Forum | Fri Dec 26 12:02:37 EST 2003 | irun

hi all we are in the face of purchasing stencil printer and we are looking for off-line with vision model. We are interested in MPM stencil Ultraprint 100 and SPM. My question is about your experience with Ultraprint 100 and SPM? Which is better, mo

voids- leaded and chip components

Electronics Forum | Mon Jan 19 18:49:42 EST 2004 | menglong

we are facing the same problem,and we are looking for some research result about voids.who can help to provide these ones ? any suggestion, pls keep me informed contact me :zhanglg@tpv.com.cn

facing cold joint problem

Electronics Forum | Sun Jan 18 10:13:59 EST 2004 | davef

Materials added to solder can change its appearance. For instance: * Gold in tin/lead solder is dull / grainy * Palladium in tin/lead solder is dull / grainy We do NOT advocate using visual appearance to define the appearance of a good and a bad so

BGA rework

Electronics Forum | Wed Mar 10 00:25:36 EST 2004 | kanwal324

We have the expertise of mounting and rework of all types of bga without facing any problem. If you want or you can give us one oppurtunity. K S Walia Xo Infotech Ltd. India

PCB post reflow cleaning

Electronics Forum | Fri Mar 26 11:48:45 EST 2004 | patrickbruneel

I know it is not easy to quantify zero. The biggest dilemma the no-residue technology is facing "disbelieve" The most accurate proof to the fact that all solids disapear under heat is TGA analysis. Test the no-residue in your facility under the rig

servo overflow

Electronics Forum | Thu Jan 20 06:01:23 EST 2005 | mhe

Hi guys, we are facing a problem - d axis servo overflow in our fuji cp-4. Can anyone please suggest some remedy? thanks deepak


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