Electronics Forum | Mon Jun 19 05:00:17 EDT 2006 | YQ Deng
Thanks very much! In fact, "Black PAD" phenomenon have been found in our product, the total BGA came off PCB during drop test. if we apply the underfill to BGA after SMD process, Could the underfill add reliablility of product?
Electronics Forum | Fri Jul 21 14:40:47 EDT 2006 | amol_kane
you can use a thermocouple welder to fuse the wires back. as a matter of fact we use the welder to create thermocouple junctions. this is way less expensive that buying already formed thermocouple junctions.
Electronics Forum | Fri Aug 11 15:42:18 EDT 2006 | H.W. Jablohmie
I do know for a fact you can eat as much Bismuth as you want and you won't die! Google it!
Electronics Forum | Wed Nov 29 01:20:44 EST 2006 | fastek
Guess- If a component drops at the camera the machine will not proceed to attempt to place it and drive the nozzle into a brick of solder paste. The line sensor will catch the fact there is no component on the nozzle and will retry to pick and place.
Electronics Forum | Thu Dec 21 22:56:30 EST 2006 | davef
Dennis We know that cyanoacrylates are flammable and breathing hazard before curing, but are unaware that the cured adhesive had those properties also. Can you give us documentation of that fact?
Electronics Forum | Tue Apr 10 13:30:42 EDT 2007 | ck_the_flip
Yes, that is indeed fact. You are a very intelligent, funny, handsome, man-of-the world! Thanks for the enlightenment.
Electronics Forum | Mon Jun 04 19:55:43 EDT 2007 | darby
Ours was accidendally left on overnight many years ago. Razed the factory to the ground. No facts - just a hunch- turn it off.
Electronics Forum | Tue Jun 12 12:14:49 EDT 2007 | slthomas
"In your example, you are comparing "Energy used to heat the solder and keep it warm" versus "Energy used to keep the solder warm" and fully discount the fact that the machine was ever turned off." Track and field fans refer to this as the "Bob Cost
Electronics Forum | Thu Jul 19 17:54:50 EDT 2007 | swag
Thanks - We ended up using a kapton stencil mainly due to the fact that we couldn't get time on the SMT lines. It worked great, protected the vias and the BGA functions fine.
Electronics Forum | Fri Jul 27 15:51:29 EDT 2007 | hussman
Well I agree with jdumont in the fact that you should reduce the center pad at least 50%. Generally the sides of the leaded ends are not plated and solder will not wick up. This means only the bottoms of the leads wil solder. Look in this area whe
