Electronics Forum: final (Page 6 of 110)

Forum Archives Now Available

Electronics Forum | Fri Aug 03 14:45:42 EDT 2001 | neil

Whew! I finally finished the archives (and they weren't that bad). All postings to the smtnet forum from 12/5/97 to present are available and fully searchable. thanks for the kick in the @$$ dave, I needed it. -neil

Mirror image BGA connectors

Electronics Forum | Wed Aug 08 21:23:15 EDT 2001 | davef

Very smooth. First, describe how this thing wowls at the moon. Next, state that process time is so long that you can't afford to make it. Finally, you ask someone to make it for you. Let's get Mikie to do it. Hey, Mikie ...

Black pad defect

Electronics Forum | Tue Feb 11 15:54:23 EST 2003 | Jodi Roepsch

I am interested in knowing if anyone has new information about the black pad defect with ENIG plating. I am interested in it from the viewpoint of risk assessment, testing done on final product to isolate failures,and root cause of the defect. Than

Black pad defect

Electronics Forum | Tue Feb 11 22:28:25 EST 2003 | davef

What do you mean by "new information"? On final module testing: * If you have hypercorroded nickel and you detect it during final testing, you'll notice it. * If you have hypercorroded nickel and you don't detect it during final testing, you'll ship

Cracked ceramic chip capacitors.

Electronics Forum | Thu Apr 10 07:24:56 EDT 2003 | pjc

I had a similar problem with cracked caps. I checked all my processes and finally found that the caps were cracked in the tape. Check the condition of the caps in the tape. This was unique to one mfg.- EPCOS.

Cracks on ceramic capacitors.

Electronics Forum | Fri Jun 20 11:05:53 EDT 2003 | russ

Why don't you give us the full process along with your delta T for the wave (final preheat temp to wave contact temp). Don't forget de-paneling, ICT, and other things. It could be from the supplier, but it usually is from excessive placement force

Conformal Coating over PBGA

Electronics Forum | Wed Aug 13 18:12:20 EDT 2003 | Carol

Has anyone tried to get conformal coating under a BGA? (large package MPC555). There is a concern with ionic/metal bridges developing between contacts due to accumulation of dust/humididty. Final product is Class 3 (aerospace). Thanks, Carol

T&R Verification

Electronics Forum | Fri Oct 03 11:26:31 EDT 2003 | radney

We have been through several stages of this journey. We had no verification initially, migrated to two person verification (with reel initialing) and finally to electronic verification. Each of these steps has given us a dramatic improvement in our

Tarnished surface upon cleaning with DI water + saponifier

Electronics Forum | Fri Feb 13 11:54:44 EST 2004 | Gary

We have an automatic washer that is using DI water in the final rinse for stainless steel surgical tools. Is this practical. Will it extented the life of the tools or just remove spots?

Need CSM Toolbox

Electronics Forum | Wed Dec 21 08:06:13 EST 2005 | dwensker

Did you solve your problem finally ? I ask because we have same problem (Data initialisation). regards


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