Electronics Forum | Sat May 05 18:18:22 EDT 2007 | colormaker
I am using a Novastar 12S solder wave with Kester water soluable fux 22-2425. I have used this for years without problems on an old Hollis machine. Just started using the Novastar and after fine tuning I get itermitten bridging on the front of the P
Electronics Forum | Fri Sep 17 03:13:00 EDT 2010 | grahamcooper22
In HASL pcb coating you need to fully coat the pads with solder and then blow off any excess solder to leave a nice coating on each pad. Generally pcb manufacturers try to give you a flat pcb pad to make your solder paste printing more consistent. To
Electronics Forum | Wed Aug 08 21:31:31 EDT 2001 | davef
OK, so yer stuck wid dees sembly guys, yer bosses are moroons wid pointy heads, and you gotta fix it. snafu. Paste printing: Measure shape, height, volume, area, registration, and paste bridging. Inspect/control solder paste deposits for fine pitc
Electronics Forum | Wed Feb 05 13:08:20 EST 2003 | joeherz
You're correct that a thicker solder deposit will make bridging on fine pitch devices a bigger risk. Another alternative could be to slightly over-print the pads (onto the soldermask) ala pin-in-paste process. Basically adding enough solder to fill
Electronics Forum | Mon Aug 16 04:47:04 EDT 1999 | Charles Stringer
| | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact wit
Electronics Forum | Tue May 02 05:59:28 EDT 2006 | davef
We agree with Ken's points about off contact / screen versus stencil, but this DHolt is talking stencil [regardless of what is typed about screens]. Comments are: * On "smears under the stencil": smearing happens. It makes us wonder about the frequ
Electronics Forum | Wed Sep 08 11:04:41 EDT 1999 | Timothy O'Neill
| I am using a 18 mil and below water soluble solder paste (89.5-25-80). I have never used this type of paste. The PCB has a fine pitch component of which I cannot prevent bridging. The paste coverage on the pad looks like it is slumping. It is not a
Electronics Forum | Wed Dec 11 06:34:24 EST 2019 | ameenullakhan
Hi Everyone, Reducing the top heaters around 10 deg each at last 3 zones of reflow oven. Helped us in achieved little lesser temperature at top connection of the CCGA. And we didn't face any bent. Bridging : Reducing the stencil aperture , has wor
Electronics Forum | Tue Jun 08 12:49:41 EDT 1999 | Dave F
| Hi,my master | How to iron out such soldering bridge with below conditions: | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | 3.using spraying fluxer and n
Electronics Forum | Tue Jun 08 13:06:53 EDT 1999 | Kevin Hussey
| | Hi,my master | | How to iron out such soldering bridge with below conditions: | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | 3.using spraying fl
.gif)
