Electronics Forum | Wed Apr 04 18:25:07 EDT 2007 | darby
Don't think much of the people who run the line do you mate? "BUT is operator dependent, so if he feels lucky just change the reel without verification and machine will not stop if he didn't follow the procedure having a high probability of Wrong co
Electronics Forum | Wed Mar 31 09:44:12 EDT 2010 | bandjwet
One thing I would suggest right off the top is to go to a paste printing process. This will get first pass yields higher (usually 10+% higher than gel flux). If you are suggesting that you have good collapse everywhere, the profile is adequate (soun
Electronics Forum | Thu Jun 25 14:45:55 EDT 1998 | Chrys
| I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will sold
Electronics Forum | Thu Dec 06 12:37:14 EST 2012 | deanm
We are having difficulty with bridging on a 2x50 pin 0.050" fine pitch connector using our selective soldering machine. It usually bridges at the end of the row, but sometimes it bridges all the pins together as it drags across (solid bridging). I
Electronics Forum | Mon Jan 04 11:59:41 EST 1999 | Steve Evers
| Give me your opinions and experiences of SelectX, selective debridging system in the Vitronics Soltec wave soldering machines. | Opinion and (food for thought)?: First let me say that I am not familiar with SelectX. In the past, manufacturing e
Electronics Forum | Mon Aug 27 08:58:24 EDT 2012 | rway
Reese, > > We would agree about the value of an > ICT system, in a general manufacturing > environment. However, a couple of notes > apply: > > 1. ICT isn't a catch-all, either, and > should be used to verify the process, not > validate it.
Electronics Forum | Tue May 08 03:14:12 EDT 2001 | sinclair
We started our first ENIG process recently and to our surprise, we have many failure on the one and only BGA on the board. The BGA is a 31 mils pitch plastic. Sending the PCBA to 1 cycle of heating/cooling @ 70/-5 degree C yield 40% of failure. With
Electronics Forum | Thu Sep 19 21:46:01 EDT 2002 | scottefiske
In the past year I was responsible for developing and leading a Team focused on AOI, Evaluation, Justification, and with a full ROI required, supporting a HMLV manufacturing environment. If you have in these economic times the additional resources t
Electronics Forum | Wed Sep 06 11:18:52 EDT 2000 | Chris May
Randy, I have been with my present company about 14 months and my first and ongoing task is to improve 1st time yield rates at ATE. Upon examination of the failures (14 months ago)there were cases of IC legs being physically wider than the pads on
Electronics Forum | Mon Dec 08 18:52:47 EST 2003 | Craig M
Stability of process is what your measuring so lets not assume a stable process(if your process was perfect you would have no defects). With no test a medium complexity board will be around 68.7% (according to Consulogic). I dont have many other sour
