Electronics Forum | Mon Jan 22 12:25:03 EST 2001 | dbonilla
Hi: I am looking for companies or consultants that can assists Manufacturing Technology Services ( Technology Alliance Division) to grow in advanced technology processes like BGA, Flip Chip, flex circuits, COB and others. I wish to know availability
Electronics Forum | Mon Apr 23 11:58:42 EDT 2001 | CAL
I personally like Universals GSM and the Siemens F series for placement machines and companies. Both have great laboratorys set up for Flip Chip processing.Both Also have industry leading experts on staff. Machine info: can they do tacky flux dispen
Electronics Forum | Fri Aug 24 09:38:17 EDT 2001 | gerits
Hi, you can use the Assembleon (Philips) ACM Micro for this. It can place Flip Chip form 0,1x0,1mm upto micro BGA, CSP's etc. etc. It even can handle Odd's and insert components. Web-site http://www.assembleon.com Please contcat me or our company o
Electronics Forum | Fri Aug 24 11:10:32 EDT 2001 | gresko
Paul, I have about 8 years experience with GSMs placing flip chips and have trained Universal customers to do the same. I don't think you can find a more versitile pick and place machine with all of the options that are available and the support yo
Electronics Forum | Thu Jul 20 16:08:18 EDT 2000 | Grant Baynham
Do you have any experience with flip chip applications using lead-free solder, and specifically do you have any information revealing how the process parameters for standard air reflow atmosphere can be modified to match the results for solder reflow
Electronics Forum | Sat Jan 30 21:04:32 EST 1999 | Sidharth
Hi all, i'm researching information on fluxless solder bumping of flip-chip by either : 1. electroplating AuSn bumps 2. electroless Ni on Al pads in an autocatalysis process. could anyone point me in the direction of more information ? partic
Electronics Forum | Sun May 31 16:07:25 EDT 1998 | Alain De Bock
Is there anyone who knows what the influence is of the dip-fluxing process on the placement accuracy of a flip-chip. If you perform dip-fluxing after component alignment, the component may be displaced on the nozzle; if you perform component alignmen
Electronics Forum | Mon Feb 23 14:52:20 EST 1998 | Igmar
| I am looking for component placer that can handle not only smc but also flip chip C4. | If there is any machine satisfying my request, please inform me. | machine name , spec, and so on. You should definitely consider the "Best-in-Class" SIPLACE
Electronics Forum | Tue Aug 20 22:37:15 EDT 2002 | dwoon
I notice that dip fluxing method is commonly used in flip chip assembly (FCOB, FCOC and FCOF). Main reason: better flux control. How about spray fluxing (e.g. the non-contact jetting technology from Asymtek)? Does anyone has experience adopting thi
Electronics Forum | Tue Nov 05 09:21:18 EST 2002 | stefwitt
After all, you may want to consider a Flip Chip process. The chips are bumped with tiny solder balls while still on the wafer. You may present the bumped chips in Gel Pack, trays or Surftape to your Pick $ Place machine ( if capable for Flip Chip pl
