Electronics Forum | Fri Oct 12 13:40:56 EDT 2001 | Steve
I need help with a process issue. I am dealing with a board design that is double-sided SM with a couple high density through-hole devices. I want to flow solder the through-hole stuff, so what is the best way to deal with them? Since one of the thro
Electronics Forum | Fri Jan 24 09:04:54 EST 2003 | russ
How are these connectors and dips oriented? If the leads are parallel as opposed to perpendicular to to the wave this can promote bridging depending on spacing and length. The long leads showing icicling are most likely either inadequate heat OR the
Electronics Forum | Thu Feb 19 09:02:43 EST 2004 | russ
This is a pretty common sympton when wave soldering chip components. As a note IPC allows for this in wave process. The problem is in the pell off of the wave and you may not be able to fix. Is your back flow off of the wave only present when a bo
Electronics Forum | Tue Feb 07 21:34:52 EST 2006 | davef
We agree that curing Loctite 3515 at lead-free temperatures is not a good idea. For lead-free, we know of some no-flow underfills, but no capillary flow underfills. Contact your underfill supplier for recommendations. When you have this conversati
Electronics Forum | Thu Apr 05 08:59:43 EDT 2007 | rgduval
Dave, I've seen some instances of solder as you mentioned "painted" over the joint. Almost looks like a seam between the added solder and the originally waved on solder. Typically, I've seen that in the past from an incomplete solder joint. One w
Electronics Forum | Wed Feb 20 18:21:49 EST 2013 | caurbach
A question for all you wave experts out there: We run our wave with a constant flow over the back plate. I know it's recommended that we set the back plate so that the solder sits just at the top of the back plate with surface tension keeping it fr
Electronics Forum | Mon Jun 17 09:52:33 EDT 2013 | sara_pcb
My circuit board contains 11 x 11 matrix 1mm pitch BGA, The device was tested in socket on evaluation Board. We handed over the actual PCB & devices for re-flow. The assembly house first re-flowed all the SMT components other than BGA. BGA was placed
Electronics Forum | Wed Nov 19 10:47:37 EST 2014 | grahamcooper22
Probably not all the overpinted paste is flowing onto the joint. You may need a paste with great coalescence properties so it all flows together, and doesn't leave any on the resist. Does the paste drip out the through hole too ? If so it suggests it
Electronics Forum | Wed Aug 16 12:14:20 EDT 2000 | genglish
Is anyone using the Crossflow pastepuck. What are the benifits and results?. Does is compete with the ProFlow?.
Electronics Forum | Wed Mar 15 20:28:17 EST 2000 | Dave F
Armin: Locating vias within the courtyard of components is bad practice. Concerns are: * Poor solder paste print quality, caused by the via preventing good stencil gasketing. * Poor component reflow, caused by the via holding the component out o
