Electronics Forum | Fri Dec 17 16:23:22 EST 1999 | Mike Naddra
Hello Henry, Tombstoning is caused (In most cases) by a force imbalance on either side of the component. As the solder becomes liquidous the surface tension of the liquid will pull the component to the center of the liquidous area. To solve the probl
Electronics Forum | Fri Oct 05 07:46:24 EDT 2001 | george
Specifications of testing force are not fixed, but (incase of wave soldering) the value should be at least 120-150 % of the force the wave. So for small chip components we assume that the force from the wave on the component is about 3 Newton, this m
Electronics Forum | Fri Sep 26 08:15:01 EDT 2003 | Gabriele
Forced gas (hot air or N2 according to solder paste or flux) will be the solution. To rework Ceramic (Aluminum lid Heat Sink)BGA (32 mm square ) or Ceramic Colum Grid Array C-CGA 1,25 and 1,00 mm colum (pitch 42,5mm square), also them capped with a
Electronics Forum | Wed Jan 05 11:26:15 EST 2005 | cyber_wolf
Then Z MOTOR > Then select>CALIBRATE FORCE SENSOR NOTE: you must have a tool in the head when you do this.(Without the tip/spring pushed in) After this calibration the force should drop to 0 when you push in on the spring loaded tip. 2.) Replace th
Electronics Forum | Wed Nov 02 13:24:09 EST 2005 | valuems
Hello Sorry we have not answered sooner, been gone. There is a height adjustment on the wiper. You will find a round nob under it, that is a height adjustment. I expect the wiper is not going all of the way up. And you can also control the speed
Electronics Forum | Mon Jan 23 03:17:10 EST 2006 | pavel_murtishev
Good morning, IR reflow is yesterday technology. IR heating principle has a lot of issues with heat transfer capability (shadow effect) and uneven PCB heating. To avoid this forced convection ovens were developed. Reflow oven for SMD soldering must
Electronics Forum | Thu Aug 31 16:18:30 EDT 2006 | GS
I beg you pardon AR, I made a mistake by reading your request, you are looking for a service lab who can do the peel back force test and not the Reference Standard (like EIA-481) for T&R. You should check if in your Country some Tape and Reeling Serv
Electronics Forum | Tue Oct 14 09:17:09 EDT 2014 | rgduval
You could check the data sheets/web sites from the manufacturers of the press-fit parts. They typically will identify the recommended tooling/equipment necessary to install their components. Generally, pneumatic presses are suggested, with controll
Electronics Forum | Fri Mar 30 13:06:50 EST 2001 | aortiz
Hi, I need support on the method or applicable standard to measure the shear force strength on chip capacitors and resistors. I know the soldered joints strength is related to land desing, solder volume, pcb and component solderability, component
Electronics Forum | Wed Apr 14 13:52:21 EDT 1999 | Iliana Lopez
I'm trying to find out the standards of EIA-481 for Peel Back Force.
