Electronics Forum | Wed Jul 11 14:48:25 EDT 2007 | rgduval
My boss just received some info through a design mailing list that he's on claiming that FR406 is not RoHS compliant based on the limited number of processing cycles at RoHS compliant temperatures. I would guess that this is related to the relativel
Electronics Forum | Fri Nov 16 08:22:03 EST 2007 | ck_the_flip
For those of you who've completely switched to Pb-Free or who're running in a mixed environment, are you also buying or specifying the "RoHS PCBs" - the ones with * Greater Tg (glass transition temperature) * Thru-holes with limited drill hits and
Electronics Forum | Mon Nov 13 13:15:51 EST 2006 | CK the Flip
Tg, by definition is the glass transition temperature for materials. It's the temperature where your board goes from rigid to "rubbery". Not sure if a higher Tg would help prevent delam. One of the PCB experts of the forum might know this.
Electronics Forum | Wed May 10 16:49:14 EDT 2000 | Michael Parker
I would like informnation regarding this high heat withstanding type material for PCB, also any other types that are compatible. We currently use FR4 but have an application that may require most advanced composition.
Electronics Forum | Fri Oct 05 09:15:23 EDT 2001 | Ben Bierlein
It is a PCB material that has a woven glass / epoxy internal core and glass veil surface. It is in between the paper materials (FR1,FR2 and CEM1) and FR-4 as far as strength and cost. It is available in HiCTI material for high power applications.
Electronics Forum | Thu Apr 18 11:44:34 EDT 2002 | jsmith01
Does anyone know of a PCB material that is better at preventing arcing than fr4 or g10?
Electronics Forum | Wed Apr 03 14:40:13 EDT 2013 | bandjwet
During the reflow process what are you finding most effective for shielding temperature sensitive components? Ceramic shields, FR-4, sheet metal, machined high temp plastic, cermic non-woven shields
Electronics Forum | Wed Nov 17 09:02:57 EST 1999 | Dave F
John: The 180 Tg point is a sweet spot for obtaining heat resistance, cost effectivly. These high technology boards provide good thermal resistance for wire bonding, direct chip attach, and BGA mounting and rework. Since these boards are harder th
Electronics Forum | Thu Aug 17 22:22:29 EDT 2000 | C.J. Long
Hi erverybody: I am from a PCB shop. One of our product is with 19 X 19 ceramic BGA and my customer is experiencing 0.1 - 04 % failure of open trace on cornoer BGA pad. Substrate is FR4 with TG 135 degree C and delta Tg is well below 3 degree C. Tra
Electronics Forum | Mon Jan 24 18:04:46 EST 2005 | Dreamsniper
=130�C as per IPC-4104/21 What will happen if I expose the PWB Assembly with components to a temperature of between 135'C to 152'C, which is above Tg, for 1 hour? Will there be delamination or possible damage to my PWB? What about with the rests of
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