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Optimizing Flip Chip Substrate Layout for Assembly

Optimizing Flip Chip Substrate Layout for Assembly Optimizing Flip Chip Substrate Layout for Assembly High-density flip chip applications are commonly limited by the available substrate technologies. Accordingly, considerable design efforts


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The Branford Group
The Branford Group

A global industrial auction and valuation business with extensive experience in SMT, PCB Assembly & Manufacturing, Test, Semiconductor and other Electronics Machinery & Equipment.

Manufacturer / Equipment Dealer / Broker / Auctions

896 Main Street
Branford, CT USA

Phone: 203-488-7020

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Benchtop Fluid Dispenser
Selective soldering solutions with Jade soldering machine

Component Placement 101 Training Course
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World's Best Reflow Oven Customizable for Unique Applications