Electronics Forum | Wed Sep 23 15:16:22 EDT 2009 | davef
Santiago can still maintain his current PTH, SMT, Reflow, Glue, Wave solder process flow and print glue with a stencil. In this, the bottom-side [contact-side] of the glue stencil requires cutting pockets that correspond with the clinched PTH leads.
Electronics Forum | Tue Nov 24 23:55:58 EST 2009 | henry_usa_stencils
You can order the glue stencil at http://www.usastencils.com They can design the opening of the apertures on the stencil in the middle of the caps so you can screen an adhesives through the opening then you will have it right on the center of the cap
Electronics Forum | Thu Jul 06 08:22:04 EDT 2000 | David Chapman
Have you thought about stencils for glue? We stencil all glue boards quite succesfully. No CAD no clogged nozzles, much faster speed aperture designs are fun to work with. Just a thought for an alternative. All the companies mentioned also will advis
Electronics Forum | Fri Jul 16 03:11:23 EDT 1999 | SPEZZAFERRI Luca
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
Electronics Forum | Wed Jan 22 15:22:53 EST 2003 | davef
Hey "Dispenser Boy" does this mean we can have your machine? ;P I'll be out to supervise the packing with a Hook in my hand. Poke around the fine SMTnet Archives to get started on aperture design. 7525, Stencil Design Guidelines is pretty much of
Electronics Forum | Sun Oct 31 11:07:09 EDT 2010 | Mark
http://www.shanelo.co.za/Article%20to%20assist%20with%20Stencil%20Design%20Guidelines.htm Stencil design
Electronics Forum | Thu Feb 15 17:08:34 EST 2018 | davef
IPC-7525A - Stencil Design Guidelines http://www.ipc.org/TOC/IPC-7525A.pdf
Electronics Forum | Mon May 21 17:34:22 EDT 2001 | davef
Continuing the line of Michael's, the previous poster, comments ... The more Krispy Kremes, the better. Yeth!!! The more beer, the better. Yeth!!! The more epoxy, the better. Uh, I don think so!!! We look at this from a papa bear, mama bear, bab
Electronics Forum | Wed Jul 14 21:34:16 EDT 1999 | karlin
| | | | | Hi, | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | |
Electronics Forum | Wed Jan 16 20:06:09 EST 2002 | davef
No, not as such. Consider: * Using the IPC calculator [free at http://www.ipc.org]. It allows you to consider / assess the amount of solder when designing pads. * Reviewing IPC-7525 - Stencil Design Guidelines. It gives general aperture guidelines.
