Electronics Forum | Thu Dec 29 10:47:05 EST 2005 | Chris
The paper Dave posted the link for is great. I have to go back and read it in depth. I can build prototypes by wirebonding to ENIG. I can do it on a manual wirebonder but I don't have the patience to do it on a magazine to magazine automatic machi
Electronics Forum | Wed Nov 24 21:03:57 EST 2021 | djenkins62
Hello Everyone In Board World, Looking for some discussion on calculating how long moisture sentive boards can be stored on shelves with forum in 3.3.2.2.1 Desiccant Quantity Calculation When the desiccant capacity at 10% RH and 25 °C is known, th
Electronics Forum | Sat Feb 10 17:12:03 EST 2001 | rpereira
I admit, 16 mil QFP printing is very challenging but if all your control factors (print speed, etc...) are setup correctly (through DOE) extremely high yields can be achieved and more importantly a repeatable and robust product will be manufactured.
Electronics Forum | Thu Jul 20 16:23:08 EDT 2000 | Bob Willis
We set up and ran this process at Nepcon UK with some success but we used a UV adhesive less than 10sec cure so no heat. Push off force for the biggest parts was over 800 grams. We have had to modify the design rules a little to make it work but it
Electronics Forum | Tue Sep 04 18:11:18 EDT 2001 | davef
Assuming you're asking about double sided reflow soldering ... Use pad mating to lead wetting area. Bob Willis has found the ratio to be as much as 44 grams/sq in. Check Bob's site [Electronic Presentation Sevices] for more. Phil Zarro uses the
Electronics Forum | Mon Feb 03 18:00:49 EST 2003 | slthomas
I know that the accepted (by some, although some say it may be too conservative) rule is anything less than or equal to 30 grams/square inch of surface contact area should stay on the bottom side during the second pass. How is that surface area meas
Electronics Forum | Fri Aug 06 11:07:49 EDT 2004 | JB
"I thought it was purely a mechanical up-down movement with the cam and hence the thickness hardly has any effect!" It is purely mechanical.On our high speed turret the machine knows the distance between the tip of the nozzle and the top surface of
Electronics Forum | Wed Nov 28 17:02:28 EST 2007 | joeherz
We use TraCon's TraBond 2112 for staking applications where larger gaps are involved. It is formulated for PCB staking applications. The material is very low sag and high viscosity. It's 2part and comes in handy bi-paks. Work life is 20-30min.
Electronics Forum | Tue May 20 12:20:18 EDT 2008 | danimalz
Does anyone have an easy way to estimate how much solder paste is applied to a smt pcb? I understand it varies on squeegee pressure, stencil thickness, and pitch of the components but I was looking for an average. I would assume that somewhere out th
Electronics Forum | Sat Feb 05 12:41:41 EST 2011 | ppcbs
Any distributors or do you know any distributors > that can deliver a T5 Lead solder paste by 01/25 > or close? Thank you to everyone who provided leads. I ended up getting a T5, 63/37 paste. I can't beleive how nice it prints. I'm printing 5 m
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