Electronics Forum | Fri Aug 18 00:23:21 EDT 2006 | umar
Hi SWAG/Rush/Steve, Thanks for your response, Currently I am running with 811 lead paste. Actually this problem not only effect for one assy. I got 700 models runing at my company, but almost 50% of the model I have problem with solder balls issue.
Electronics Forum | Thu May 03 15:02:59 EDT 2018 | solderingpro
Bob Willis (was the first I knew of) that has a splatter test that can be performed over a ceramic hot plate or the like. The concept is pretty straight forward, using a zoned circle, users can introduce the solder wire at a consistent rate and coun
Electronics Forum | Mon Nov 13 10:02:52 EST 2006 | pforister
Bill, We only allow 3 boards to be printed in front of the pick and place equipment. It is important to keep the abandon time to a minimum. You did not mention the paste that you use. Do you use no-clean or water soluble? Do you use lead free?
Electronics Forum | Wed Dec 22 07:20:21 EST 2010 | piter
HI I used both of solder leveling HASL and ENIG, HASL I can recommended for biger pitch is cheaper solder leveling than ENIG but problem with that solder leveling is during the reflow process HASL isn't flat and during reflow process component move
Electronics Forum | Tue Jul 23 11:06:00 EDT 2019 | majelacquinn
Currently trying to get away from using stencil printing. Looking for information on Micro-Dispensing and dot size using a Vermes MDV-3200A micro jet dispenser. I am using a Indium led free solder that has size 6 balls. With a 100 micron dispense hea
Electronics Forum | Fri May 29 15:17:14 EDT 1998 | Ryan
| Thanks Steve- Here is the whole story: The solder balls are appearing all over, similar to a splatter. They are relatively small. We are using H-Technologies S-HQ no-clean solder paste. The stencil is 6 mil and the boards are running in a ABW
Electronics Forum | Thu Aug 01 06:09:01 EDT 2002 | mzaboogie
Hi Pete, The boards are HASL. The frequency is random. The solder balls are randomly deposited along the path of the select wave, not always along the component bodies. We are very careful regarding handling. There could have been contamination on s
Electronics Forum | Fri Jun 07 10:46:16 EDT 2019 | gregoryyork
The Single Solder ball stuck to the mask may indicate undercured as well. The issue is not so much the mild No Clean flux but the potentially major active HASL flux or Silver Process chemistries causing issues. This has been through flow solder hasnt
Electronics Forum | Wed Oct 20 06:23:54 EDT 2004 | C Lampron
Hi Matt, Sounds like the HASL may be to thin on some pads and you're getting copper migration. If this is the case, and the solder paste is printing, I would asume you would see some solder balls under the BGA at X-Ray or incosistancies in ball size
Electronics Forum | Sat Aug 20 13:23:22 EDT 2011 | saju86ece
Hi, We are facing solder ball issue in Chip component of PCB. We had tried DEK parameter setting changes and also reflow setting but still now not yet solve this problem. board details are, 1.Class 2 prodct 2.HASL Finishing Plz advice me what actio
