Used SMT Equipment | Soldering - Reflow
Very Nice Vitronics XPM3 Reflow Oven For Sale See attached pictures and information below Equipment Description Vitronics Soltec XPM3 820 Reflow Oven Model Number: XPM3i820 Serial Number: X3A83008 Year: January 2011 Left to Right Process Flo
Used SMT Equipment | Soldering - Reflow
Very Nice, Super Clean, and Low Use Vitronics XPM2 Reflow Oven For Sale See attached pictures and information below Equipment Description Vitronics Soltec XPM2 820 Reflow Oven Model Number: XPM-820 Serial Number: X2A80106 Year: 2004 Left to
Used SMT Equipment | Soldering - Reflow
The latest breakthroughs associated with the Mark 5 reflow system now provide you with an even lower cost-of-ownership. Heller's new heating and cooling advances deliver up to 40% reduction in nitrogen and electrical consumption. This makes the MK 5
Used SMT Equipment | Soldering - Reflow
Heating zones: 5 Cooling zones: 2 Total heating length: 66 in. Total cooling length: 26 in. Total process length: 127 in. Total on /off load length: 11 in. Overall system length: 138.5 in. Overall system width: 52 in. Overall system height: 5
The Centurion™ is a forced-convection SMT reflow system with tight, closed-loop process control, built for today’s high-throughput PCB assembly environments. With the best heat transfer in the industry, the Centurion is able to run any profile at the
Used SMT Equipment | Soldering - Reflow
Production Overview:The 1505 MK5 from Heller Industries Inc is a Reflow Soldering Equipment with Heating Zone Length 200 mm. More details for 1505 MK5 can be seen below. With its features increases productivity, this 5 zone reflow oven improves quali
A500, A600, A800 - 5, 6 or 8 top/bottom cooling zones. Heating System: Up to eight groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air co
Industry News | 2020-04-14 18:28:48.0
ITW EAE is introducing a patent pending option for the Camalot Prodigy dispenser that was developed to ensure process stability and increase yields for underfill applications. In applications where board heat is required, a constant product temperature through the dispense process is critical to ensure process stability and repeatability. Underfill materials vary in viscosity and filler types, therefore the heat requirement for the board also varies.
S8, S10, S12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con
E8, E10, E12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con
