Electronics Forum: hot and plate (Page 6 of 33)

Re: BGA and Gold Boards

Electronics Forum | Thu Jun 25 09:53:04 EDT 1998 | Earl Moon

| | Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | | Mike | Mike, | You

Re: BGA and Gold Boards

Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon

| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, We and ind

Re: Silver Epoxy and CEM3

Electronics Forum | Fri Aug 28 23:32:39 EDT 1998 | Pete Sorenson

| Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? | What are the limitations? | Thanks, | Steve I have used silver epoxy extensively for conductive bonding applic

Re: Silver Epoxy and CEM3

Electronics Forum | Thu Aug 27 17:40:11 EDT 1998 | Earl Moon

| Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? | What are the limitations? | Thanks, | Steve Steve, Hello again. Hope you guys (Intel) aren't going to do that

UIC GSM and NiPdAu pads

Electronics Forum | Mon Oct 19 15:43:37 EDT 2009 | dilogic

We have a problem with QFN IC's with NiPdAu plated pads. Our ULC's don't see the pads due to the almost ideal reflection. Vision sees the pads almost black. As we don't have OAL-cameras (which can help in this case, I assume), I am thinking of back-l

Discoloring of Soldermask and silkscreen

Electronics Forum | Mon Apr 12 19:28:26 EDT 1999 | Tom B

Netters, When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? 1. Kester 293 no clean 2. 2.1 C/s for 30s to 150 C 3. .5 - .7 C/s for 60s to 185 C 4. 1.5 C/s u

Placement Equipment and Long Boards

Electronics Forum | Mon Apr 09 10:16:14 EDT 2007 | davef

Pick and place: * Fuji: The largest pcb size is 20" by 18" for pick and place; 18"x14" for chip shooters. Fuji NP XL series allows 27 by 23 inch boards using a conveyor. * MYDATA has machines that can be configured to 34" X 44" X 0.500" * HSP 4796A a

Re: Buying stenciling and pick and place equipement.

Electronics Forum | Mon Dec 20 13:39:08 EST 1999 | Wolfgang Busko

Hi Clarissa, seems to be a real start up situation you are in. For the printing there is IMO no need to buy any sophisticated automatic-vision-alignment-self-cleaning-inline-and-more-machine. Features you need: - adjustable in X-,Y-,Z-axis (individu

ICT and specifying PCBA testing

Electronics Forum | Tue Nov 01 14:46:31 EDT 2011 | davef

Agilent TestJet Technology White Paper In the early 1990s, the testing of digital parts became problematical. Previous in-circuit test techniques sought to ensure a correct, functioning part by applying digital patterns, called vectors, to the input

Printer and Reflow Oven Recommendations

Electronics Forum | Fri May 15 21:39:48 EDT 2015 | jlawson

Reflow.. 1.Rehm (Germany) - Best in Class Best overall process stability heating system ( Alot of makers have started to copy there VX heating arrangement ). COnveyor chains can be a bit more attention in terms of maintenance on rehm , but if foll


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