Electronics Forum | Sat Oct 01 01:04:47 EDT 2005 | ck
I face a problem where the components termination is non lead free but solder alloy is lead free. Thus i am using hybrid reflow profile. The specs for the reflow profile i am using: reflow temp. 120 to 160 deg C; time 90 to 120 sec. As for the pak te
Electronics Forum | Wed May 24 16:01:08 EDT 2006 | samir
GEB, Datasheets are usually just guidelines and most App. Engineers from paste companies will tell you that as well. You don't have to "copy exact" what they say, but rather set your oven to what gets you and your type of boards the best results. P
Electronics Forum | Sun Nov 12 09:40:47 EST 2006 | Andrew
Can someone help me to advise the best profile for a board with the combination of both Lead Free and Non-Leaded part?If possible,pls advise the best preheat and reflow time and temprature.
Electronics Forum | Fri Jul 06 12:11:34 EDT 2007 | james
We are starting to see issues with using Kester WS R562 with lead free components. The joints look grainy on almost all of the 0402'2 and other small components. Some of the solder does not solder to the terminations. These are hybrid boards which
Electronics Forum | Mon Oct 03 16:19:22 EDT 2005 | Amol
for backward compatibility applications (such as this), the higher melting temperature alloy (LF alloy) gets the priority in selecting the reflow profile. you are using too low temps for reflow. your LF alloy wont reflow at these temp and you will e
Electronics Forum | Tue Apr 18 03:40:05 EDT 2006 | Slaine
Did you try tensile testing after thermal cycling? If there are any intermetalic problems between the two alloys this should show it.
Electronics Forum | Mon Nov 13 07:58:54 EST 2006 | realchunks
It depends on your paste. Use the highest temps your existing paste can go too. Henkle Loctite makes a solder paste just for this application called MP218. There probably are others but they are available.
Electronics Forum | Fri Jun 15 22:00:23 EDT 2007 | grantp
Hi, Thanks for the reply guys, and this is interesting information. I had assumed that if we had a paste spec, and this was the spec for the solder to reflow correctly, then if I achieved that spec, the solder should perform correctly. However this
Electronics Forum | amol_kane |
Fri Apr 14 10:16:37 EDT 2006
Electronics Forum | Fri Feb 03 16:40:24 EST 2006 | Mike
At my last employer, we ran a number of tests to make a "Hybrid" profile work (same profile Joe lists) . It worked great for everything but BGAs. The problem (6 months ago) was using parts not rated for lead free reflow temps. As the market fills wit
