Electronics Forum: immersion and silver (Page 6 of 34)

Imm Silver and Voiding

Electronics Forum | Thu Jun 22 00:16:24 EDT 2006 | Gman

Hello, Has anyone had issues with voiding while using Imm Silver PCB finish. Does thickness of silver, contamination of the plating bath or other factors if you come point out cause voids due to the plating.

Silver Immersion Finish - Moisture bake out guideline?

Electronics Forum | Mon Apr 26 14:40:07 EDT 2010 | blnorman

We had one product that used immersion silver plating. There were a couple of instances where we saw tarnishing, and elemental analysis confirmed the presence of sulfur. These boards did have the anti-tarnish sheets between boards, but somehow they

Immersion gold and BGAs

Electronics Forum | Fri Aug 26 09:48:11 EDT 2005 | David

I have heard that there are problems using immersion gold on PCBs when working with BGAs. Is this correct? Is white tin more suitable?

Immersion gold and BGAs

Electronics Forum | Fri Aug 26 14:15:16 EDT 2005 | David

Where could I find more information regarding the double sided reflow and flux problems with white tin?

Immersion gold and BGAs

Electronics Forum | Tue Sep 06 09:30:34 EDT 2005 | russ

I read it in Florida Cir-teks own literature. http://www.florida cirtek.com

Imm Silver and Voiding

Electronics Forum | Thu Jun 22 07:15:37 EDT 2006 | amol_kane

do you mean microvoids or macrovoids??

Imm Silver and Voiding

Electronics Forum | Tue Jun 27 12:12:05 EDT 2006 | GMan

Yes it does seem like a plating issue and analysis is being done. Thank you for your inputs.

Imm Silver and Voiding

Electronics Forum | Wed Jun 28 02:29:48 EDT 2006 | Loco

Wow, great article there mike! Thanks for digging it up for us! Kind regards, Loco.

what is the different between ENIG and Immersion Au

Electronics Forum | Thu Jan 12 10:05:13 EST 2006 | davef

There's a lots comparisons like this on the web. Here's one: Westwood Associates said on 8/12/2003: ||HASL||OSP||ENIG||Pd||Tin||Silver Flat||no||yes||yes||yes||yes||yes Solderjoint||Cu-Sn||Cu-Sn||Ni-Sn||Ni-Sn||Cu-Sn||Cu-Sn Contact||E-test, ICT||no|

Imm Silver and Voiding

Electronics Forum | Thu Jun 22 17:47:05 EDT 2006 | davef

First, we expect voiding in imm silver to be similar to ENIG. We expect more voiding in OSP than other common solderability protection. Second, choosing a solder paste, which does not contain resins and activators that decompose at higher temperatu


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