Electronics Forum | Thu Jan 11 09:23:32 EST 2007 | mscalzo3
BE, Flux coating helps as there is no solvent to volatize. Also, we offer vacuum-cast preforms that will eliminate the possibility of the voids comimg from the alloy itself. I can email a PDF of some profiles, all I need your email address. You c
Electronics Forum | Fri Feb 29 08:14:33 EST 2008 | cyber_wolf
Thats funny that you mention the WS609. That is the exact same paste we used back in the early 90's. That formulation is notorious for drying out and getting chunky. That is a very dated flux chemistry. I would advise looking into some of the twenty
Electronics Forum | Fri Jan 24 15:46:29 EST 2014 | davef
Graping is caused by a lack of flux when the oven reflows the paste. Read [“Best Practices Reflow Profiling for Lead-Free SMT Assembly” Ed Briggs and Ronald C. Lasky, Ph.D., PE, Indium Corp] http://www.smtnet.com/library/index.cfm?fuseaction=view_ar
Electronics Forum | Thu Apr 04 09:45:58 EDT 2019 | davef
That's what I guessed. Some ideas to consider are: Reduce usage of flux to the bare minimum. Choose a low solids flux Flux residues can be categorized as soft, brittle, sticky but this depends mostly on the formulation of the flux and the resins
Electronics Forum | Thu Sep 29 17:42:49 EDT 2011 | action_101
I used Indium WF-9940 at the last place I was at for 5 years. We ran leaded and lead free product in our ERSAflow selective soldering machine with that flux type. It worked good for both applications. The place I am at now we have an Ersaflow selecti
Electronics Forum | Wed Jul 24 22:45:54 EDT 2002 | davef
WS609 is a wonderful paste. J-STD-001, 4.2 states words to the effect that for Class 3 products Type H or M fluxes should only be used for tinning operatins. Most water soluable fluxes are either H or M. I believe that you can use Type H or M flux
Electronics Forum | Fri Jan 22 17:03:55 EST 1999 | Ross Berntson
| I'm currently planning to do an evaluation of RMA flux solder pastes for mil type applications. Does anyone have any suggestions for vendors to try? I'm especailly interested in pastes that aid application on boards with 20 mil pitch. | I am fro
Electronics Forum | Mon Jan 20 17:42:45 EST 2003 | jonfox
Double check the data sheets for your paste. Just as an example, ou Indium paste has a recommendation for the Heating, Liquidus, and Cooling stagees of reflow. They recommend a linear ramp up of 0.5 to 1.0 degree C. In the Liquidus stage, a peak t
Electronics Forum | Thu Oct 05 12:14:15 EDT 2006 | Mario Scalzo, SMT CPE
Good afternoon! We have had great luck with semi-aqueous cleaners from Kyzen and Zestron, and normally recommend both of them. They both have great labs and would gladly offer their input on he cleaning of the flux residue. We make sure that these
Electronics Forum | Thu May 22 16:52:39 EDT 2008 | tonyamenson
Indium got back to me with the attached PDF. I always assumed, that in order to avoid thermal shock, there could not be any more than 80 degrees C difference between the solder pot and the pre-heated board. However, it would seem that any thing le
