Electronics Forum | Tue Aug 22 11:44:34 EDT 2000 | simmons_timothy_g
With all of the possibilities and combinations of alloys availabe, what in your opinion will the industry change to so that lead is removed from the process?
Electronics Forum | Mon Apr 30 10:48:10 EDT 2001 | CAL
oktayunsal- Machines are your secondary problem. Knowing and understanding SMT process is your biggest obstacle. SMT process involves Electrical, Chemical, Industrial, and mechanical engineering disciplines.As a start I would begin with IPC related
Electronics Forum | Sun Jun 23 23:23:25 EDT 2002 | beldorian
First question - I am making an assumption that after "de-pop'ing" a BGA prior to socketing the thing to test it, the best known practice is to re-ball the thing. Is this an industry standard? Second question - If it is an industry standard, does a
Electronics Forum | Wed Apr 15 12:55:31 EDT 1998 | Matthias Mansfeld
O.K., somebody read a probably hand-written 3 as 8. Under these numbers, I can find at IBM's Patent Server the following other topics: USP 4,312,692 http://www.patents.ibm.com/details?patent_number=4312692: USP 4,314,870 http://www.patents.ibm.com
Electronics Forum | Tue Apr 20 19:34:13 EDT 2004 | Ken
ImAg is the Surface finish of choice for Intel mother boards....Tin/lead and lead free processes. I think palladium and soft gold are the preferred for wire bondable apps.
Electronics Forum | Mon Jan 21 18:58:21 EST 2008 | davef
We have read papers espousing using xray, but have never seen such a thing. It seems the contrast provided in the xray images is insufficient for analysis of the underfill.
Electronics Forum | Wed Dec 04 17:56:53 EST 2019 | davef
Almost all of the legs appear to have a jumper wire twisted over the leg. It's particularly obvious in the later close-up image. Were the jumpers added during a repair process or was that part of the original design?
Electronics Forum | Fri Jul 31 18:56:24 EDT 2020 | rsatmech
I have attached few X ray images along with its components. I am regularly getting this issue from the same component. What is the root cause for this?? Is it component issue or my process issues. Kindly enlight me.
Electronics Forum | Fri Oct 16 07:06:10 EDT 1998 | Gerry Gillies
In the past year I have introduced a component reclaim process. There are a number of machines on the market, though it's true that reclaim is still a fairly labour intensive activity. We have had good results with a German machine manufactured by Ro
Electronics Forum | Thu Aug 23 12:46:30 EDT 2001 | mkallen
In this case, I know my supplier's data is good. They've been supplying this particular PN for a long time now, and the stretch problem appears to be random within a given date code (i.e., most of the boards in each lot are good, but a few exhibit t
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