Electronics Forum | Tue Nov 05 11:53:50 EST 2019 | markhoch
Does anyone have any experience trying to solder Anticapillary or Silicone Blocked (SBT) wire? It's designed to inhibit wicking of liquids and unfortunately that includes molten solder. We're experimenting with it for a potential high volume applicat
Electronics Forum | Thu Sep 30 11:23:41 EDT 1999 | Wolfgang Busko
| We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control an
Electronics Forum | Thu Aug 24 16:59:11 EDT 2000 | Dr. Ning-Cheng Lee
For reflowed solder joints, Bi bearing solder has been reported to exhibit superior fatigue resistance. It also provides better wetting than many other alternatives, including SnAgCu systems. In my opinion, it may be the choice once all Pb can be pha
Electronics Forum | Thu Aug 24 08:50:22 EDT 2000 | Dr. Ning-Cheng Lee
The conversion into Pb-free very likely will be dictated by the feasibility of conversion. Exemption may be allowed for those sectors facing greater challenges. For instance, the industry is having difficulty in finding acceptable Pb-free alternative
Electronics Forum | Tue Dec 07 20:07:21 EST 1999 | Dave C.
Thanks for all the info Dave. It's the interconnect between the copper foil pad and the eutectic solder ball that I'm most interested in. The BGA in question is very thin gold plated over nickel over the copper. When we are reworking the BGA, i
Electronics Forum | Thu Mar 18 10:09:57 EST 1999 | Stefan Witte
| My engineering Dept. has informed me that they want | to start using pins, on an aluminum substrate in the | smt process. Pins are interconnect for daughter bds. | Dia. of pins 0.020" 0.040" 0.080" flat bottoms | 1) Does any one know how to
Electronics Forum | Mon Dec 28 12:16:40 EST 1998 | Jon Medernach
Chris, We are involved in several developments using gold stud bump attach. We make a stud bump bonder and have several processes for attach. Solder attach is best done by plating up the substrate, the underfill must be able to provide enough mechan
Electronics Forum | Tue Dec 29 10:24:35 EST 1998 | Earl Moon
| Chris, We are involved in several developments using gold stud bump attach. We make a stud bump bonder and have several processes for attach. Solder attach is best done by plating up the substrate, the underfill must be able to provide enough mech
Electronics Forum | Tue Jun 30 18:40:07 EDT 1998 | Earl Moon
| I would be very grateful if someone could provide me with recent figures (schemes)of | 1. pin through hole assembly | 2. hybrid circuit | 3. surface mount technology. | Or could anyone tell me where I can find such information? | Thanks a lot. | Ma
Electronics Forum | Mon Aug 13 18:21:54 EDT 2001 | delnosa
Trying to find out if there are any data/articles/references out there that looks at the reliability of using SMC�s over interconnects(connectors). The dilemma is having a daughter card with a board-to-board connector vs. having the components (dis
