Electronics Forum | Thu Jun 04 11:57:59 EDT 1998 | Pete M
Be more specific on your problems? | If you could measure and chart 3 variables in my process, what would they be? | The boards that I produce are on panels that are 12up and 2x4 up. All boards are single sided paper base w/o plated thru holes. The
Electronics Forum | Wed Sep 26 09:56:50 EDT 2001 | John S
This will probably sound like a dumb question, but... I have a specific 1206 chip resistor that routinely ends up placed upside down on the pcb. We use Juki 750 placement machines. I normally run the machine with the auto-correct for the pick posi
Electronics Forum | Wed Sep 26 16:32:40 EDT 2001 | davef
Placing a component the correct side up: * May affect heat dissipation. [Umm, that sounds like stretch, but who knows what designers think about?] * Allows reading the markings on those components that have markings, however cryptic the notation of
Electronics Forum | Mon Feb 18 17:27:03 EST 2002 | hgwells
Agilent has a great article on determining whether automated optical inspection (AOI) or automated x-ray inspection (AXI) is right for you. It's a PDF file that can found here: http://www.ate.agilent.com/EMT/LIBRARY/X-RAY/DOCS/59883661en.pdf To sum
Electronics Forum | Wed Aug 20 10:27:25 EDT 2003 | Dan Gosselin
Do any of you guys have a list of parts that cannot survive hanging upside down during reflow soldering. As our board designs become increasingly dense and higher speed, we need to use all available pcb real estate. This means locating parts we hi
Electronics Forum | Fri Jul 23 05:14:40 EDT 2004 | greg york
Hi Thomas Ever considered that this maybe HASL flux left on PCB as this is extremely hygroscopic and has heat transfer fluids that cannot be baked out unless you go to a temperature of around 600C. One way of testing is to leave iron tip on joint an
Electronics Forum | Fri Jan 19 04:12:37 EST 2007 | AR
Hi I know that pump stencil technology can be used to print adhesive on boards with TH components already placed and clinched, but what about solder paste? The production sequence goes like this: First the jumper wires are placed and clinched with
Electronics Forum | Thu Apr 12 09:50:51 EDT 2007 | pjc
There have been many designs of apertures for 0402, round, home plate, inverted home plate and various reduction amounts for square or rectangular apertures. What works best for a given application depends on PCB design, solder land finish, stencil t
Electronics Forum | Fri Jan 16 16:36:37 EST 2009 | rwyman
We've used our standard chipbonder- Heraeus PD944- for this type of application. While it does cure before reflow, when the part is placed onto the site, the material compresses and spreads and thus that potential standoff isn't an issue. We've als
Electronics Forum | Mon Jan 20 11:11:24 EST 2014 | fnorradd
I have an Ersa Versaflow selective solder machine (single bath) which runs via a Profibus control system. I have checked all of the settings on the inverter, and all of the connections and outputs throughout the machine, but the machine returns a 68
