Industry News | 2014-12-02 12:25:34.0
Aqueous Technologies has acquired a new manufacturing facility located in Southern California in the city of Corona. Aqueous Technologies' new facility will house all manufacturing, sales, service and other administrative departments.
Industry News | 2017-08-29 15:45:56.0
KYZEN is pleased to announce that Dr. Mike Bixenman, DBA, has co-authored three papers that will be presented during the technical conference at SMTA International. The SMTA International Technical Conference is scheduled to take place Sept. 17-21, 2017 at the Donald E. Stephens Convention Center in Rosemont, IL.
Industry News | 2014-09-08 12:38:53.0
Aqueous Technologies announces that Mike Konrad and John Hall will present at the Assembly Cleaning, Coating and Reliability Workshop. The event is scheduled to take place Tuesday, Sept. 16, 2014 from 9 a.m.-3:30 p.m. at Henkel Consumer Goods Inc.’s facility in Scottsdale, AZ.
Industry News | 2010-06-21 14:24:32.0
RANCHO CUCAMONGA, CA — Aqueous Technologies Corp., North America’s largest provider of batch defluxing systems, introduces the Trident OneShot automatic defluxing and cleanliness testing system. Trident OneShot is designed to provide automatic cleaning (de-fluxing), cleanliness testing, and drying of post-reflow circuit assemblies. The system provides the same cleaning, cleanliness testing, and drying performance of the multi-award winning Trident III Series at almost half of the cost.
Industry News | 2015-08-10 18:38:20.0
Aqueous Technologies announces that its CEO Michael Konrad will present at the Huntsville Cleaning & Reliability Workshop, scheduled to take place Thursday, September 10, 2015 in Huntsville, AL. Mr. Konrad will present “A Candid Conversation About Cleaning” during the free technical workshop. The event will be presented in cooperation with Henkel, KYZEN and PVA.
Industry News | 2011-04-20 14:40:25.0
Aqueous Technologies Corp. announces that it will exhibit its award-winning Trident Series Automatic Defluxing System in distributor Shanghai Jamron Electronic Engineering Co. booth #2G32 at the upcoming NEPCON China 2011, scheduled to take place May 11-13, 2011 in Shanghai, China.
Industry News | 2018-10-18 09:34:29.0
Application of lead-free solder
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2018-12-13 03:35:05.0
Pick And Place Machine
