393 ipc and sm results

Electronics Forum: ipc and sm (Page 6 of 40)

Samsung SM-321 placer, pros and cons

Electronics Forum | Thu Apr 12 06:09:06 EDT 2007 | pavel_murtishev

Dear Samsung SM-321 users, Could you tell me what the pros and cons of Samsung SM-321 placement machine are? Any input is much appreciated. Thanks in advance. BR, Pavel

Pick and Place Machine Validation

Electronics Forum | Wed Mar 16 22:45:29 EST 2005 | MG Cyr

Thanks for the positive feedback. In addition our standard manufacturing validation, all of our Platform SM products (GSM, Advantis, Genesis etc.)include "on-board" CPK validation and "self calibration". In addition we do have a global relationship w

BGA Solder Acceptance Criteria

Electronics Forum | Thu Aug 31 07:42:25 EDT 2006 | davef

IPC-SM-785 - Guidelines For Accelerated Reliability Testing Of SM Solder Attachments

MSD in asembly and rework

Electronics Forum | Mon Mar 23 16:20:10 EST 1998 | Robin Arnold

Do you know if there is an IPC standard or industry standard that addresses the proper process for handling MSD's in the production environment....? (rework etc.) Not the receiving area. Thanks so much, Robin Arnold PCB Development Harris Semiconduc

MSD in asembly and rework

Electronics Forum | Mon Mar 23 16:17:39 EST 1998 | Robin Arnold

Do you know if ther is an IPc standard or industry standard that addreese the issues regarding the proper process for handling MSD's in the production environment....? (rework etc.) Not the receiving area. Thanks so much, Robin Arnold PCB Development

board stretch and IPC -D-300G

Electronics Forum | Tue Nov 13 09:25:42 EST 2001 | davef

Maybe. While it doesn't help with your current problem, there is nothing that says that you cannot impose requirements in your purchase order that are stricter than D-300.

voids- leaded and chip components

Electronics Forum | Mon Jan 12 18:06:38 EST 2004 | Kris

Hi, Is there any standard for voids in a leaded device or a chip component ? IPC 7095 lists maximum allowable voiding for BGA devices but has no information on leaded devices Appreciate your help- thanks

V-scoring design and equipment questions

Electronics Forum | Mon Jun 12 14:33:40 EDT 2006 | pjc

IPC spec is V-score shall not be more than 1/2 board thickness. They should be V scoring 1/4 off top and 1/4 off bottom equally.

V-scoring design and equipment questions

Electronics Forum | Tue Jun 13 08:33:11 EDT 2006 | davef

IPC-2222, 5.3.1 defines the parameters of making scoring cuts and the tolerance of the cuts, but does not specify the cuts. Our spec for 0.062" thick FR-4 boards is: 0.018-0.024"