264 ipc standard acceptance criteria solder balls results

Electronics Forum: ipc standard acceptance criteria solder balls (Page 6 of 27)

IPC-J-STD vs IPC-A-610

Electronics Forum | Sat Jul 22 04:52:31 EDT 2023 | shrikant_borkar

Here below clarification may help you I suggest you to refer IPC-AJ-820A Assembly and Joining Handbook for the entire information of applicable standards. IPC-J-STD (IPC-Joint Standard): IPC-J-STD is not a standalone standard; it refers to the serie

IPC Standard for Acceptable and Reject Criteria

Electronics Forum | Wed Nov 03 09:42:31 EST 2004 | dramos1

Hi Simon, Thanks for the immediate reply. We really appreciate it very much. Currently, we are using Class 2 for the visual inspection criteria of our telecom boards. In IPC-A-610 Rev. C criteria, there are TARGET, ACCEPTABLE and REJECT criterias.

IPC Standard for Acceptable and Reject Criteria

Electronics Forum | Wed Nov 03 09:59:47 EST 2004 | Simon UK

Hi Dennis, I would say that you must meet one of the acceptable critera if you have others list, but it depends. Do you have a specific query in relation to a solder joint or other defect?? Simon UK

IPC Standard for Acceptable and Reject Criteria

Electronics Forum | Wed Nov 03 09:07:07 EST 2004 | dramos1

Hi, We would like to know on the IPC-A-610 rev. C standard for acceptable and reject criteria, do we have to satisfy all that are listed on the manual or either one will be OK? Thanks for all the assistance that will provided. Dennis1

Solder Ball Criteria

Electronics Forum | Tue Mar 17 07:32:10 EDT 2009 | davef

Solder ball acceptance: IPC-A-610, 6.5.3.1 & 12.4.10. Solder balls: 5 ball system: * No more than 5 balls per square inch (100mm2) allowed * Solder balls can not be greater than 5 mil (0.005in) (100um) * Solder balls cannot be less than 5 mil (100um)

PBGA Double Drop

Electronics Forum | Fri Jul 12 03:05:30 EDT 2002 | Dreamsniper

Is there a standard with regards to the height of a PBGA ball diameter that will say that it has undergone a double drop ? What is the criteria of identifying that a PBGA solder ball has done a double drop and that it is acceptable or not acceptable.

Re: Workmanship Standards

Electronics Forum | Mon Apr 10 22:32:14 EDT 2000 | Dave F

Mark: If you're looking for a baseline document for judging the acceptability of: * Mechanical assembly * Component installation * Soldering * Cleanliness * Marking * Coating * Laminate condition * Discrete wiring * Surface mounting of components .

IPC Standard for Acceptable and Reject Criteria

Electronics Forum | Wed Nov 03 16:32:20 EST 2004 | dramos1

Hi Dave, Thanks a lot for the clarification. In order to be in compliance with IPC standard, ALL criteria has to be met [in conformance]. If either one did not met, then this is a non-conformance. Again, thanks really appreciate your help. With be

X-Ray Criteria for BGA Solder Ball

Electronics Forum | Wed Oct 20 14:24:32 EDT 2004 | Steve Gregory

It all depends where the voids are, and that's tough to do with a transmission x-ray. One needs to be able tilt the assembly at 45-degrees during x-ray, so you can get an idea where the void is. Or, you spend some big bucks for an x-ray laminography