Electronics Forum: jedec and moisture (Page 6 of 15)

Re: Solderability of BGA and PCB

Electronics Forum | Mon Nov 27 17:50:01 EST 2000 | Dave F

Mike: It gets more humid in the winter? [I can see it�s true (not that I�d doubt you) cause I�m looking a a humidy map of the USA, right now] How does that work outin Californy? [Do the ocean breezes move the humid air in-land in the summer? Er w

Re: Solderability of BGA and PCB

Electronics Forum | Mon Nov 27 19:32:02 EST 2000 | Michael Parker

Prof. Whoopee - amazing facts that you find on your 3-D BB, it has completely confounded my comrade, Chumley. Plainly spoken that around the SF Bay Area a.k.a. Silicon Valley(ever hear of the famous SF Fog?)during the winter months, near the coast a

Re: Solderability of BGA and PCB

Electronics Forum | Mon Nov 20 21:02:46 EST 2000 | Michael Psrker

First question I have for you is: Are you assuming that standard precautions are in place at your facility to minimize moisture content i.e. air- deionizers, vacuum sealed packaging, humidity control in storage and manufacturing? You do not mention

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Thu Aug 21 16:00:31 EDT 2014 | davef

This links to a NPL presentation on moisture removal from PCB http://www.npl.co.uk/upload/pdf/20140318_effect_baking.pdf Consider: * Focusing on preventing moisture contamination of boards, rather than removing moisture * There will be no standard

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Mon May 16 15:53:17 EDT 2005 | adrian_nishimoto

This has been a problem with new components coming directly from vacuum sealed desiccant packed moisture barrier bags with moisture level cards. We have also baked all boards prior to the BGA rework to ensure no moisture issues were addressed.

Tape and Reel - IPC/JEDEC or other Standards ?

Electronics Forum | Tue Jan 23 17:48:17 EST 2007 | GS

for SMDs, try to look for EIA-481.1.2.3, or may be the new version EIA-200 if I am not wrong. Also IEC 60286-2 (leaded components like axials, radials,..) Regards......GS

Tape and Reel - IPC/JEDEC or other Standards ?

Electronics Forum | Thu Jan 25 04:47:19 EST 2007 | GS

see also the complete specific series of IEC-60286,IEC-60286-3, IEC-60286-4, IEC-60286-5,IEC-60286-6. All of those specs are realated to packaging specifications. Tape, reel,stick magazine,tray, bulk case,etc. Regards.....GS

Tape and Reel - IPC/JEDEC or other Standards ?

Electronics Forum | Thu Jan 25 11:40:54 EST 2007 | slthomas

I have always referenced the following tape and reel specificatons for automated handling: Axial - EIA 296 Radial - EIA 468 SMD - EIA 481

Matrix/Jedec tray changeover at pick and place surface mount.

Electronics Forum | Tue Oct 12 13:03:18 EDT 2021 | cunningham

Afternoon all, Do you use any special surface other that ESD matting when changing over matrix trays? We currently use a earthed wire trolley that we keep trays and MSD bags on and when replenishing stock its carried out on the trolley. Does anyon

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Sun Aug 17 19:06:42 EDT 2014 | natashakt

Hi All, I have been looking in to some failures of PCB's in Assembly. After SMT the boards are stored for different periods of time in high humity environment (72% RH and 21.4 degrees Celsius) before being sent to Assembly to be handsoldered/put thr


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