Electronics Forum | Thu May 01 15:11:37 EDT 2008 | dphilbrick
CK So as I see it batch B represents a leaded process with leaded components and D is a leaded process with lead free components. Batch Components Paste B SnPb Sn62 D Lead-free Sn62 If so it is BETTER to run a lead free BGA with Sn
Electronics Forum | Sun Dec 11 20:23:52 EST 2005 | grantp
Hi, As far as I know soldering a lead free BGA in a lead process is similar to soldering down some BGA's such as ceramic that had high temp solder balls. Remember back when a lot of BGA's had hi temp solder balls that also did not collapse during re
Electronics Forum | Fri Oct 31 16:53:30 EST 2003 | Raider
Another well-organized site with loads of info: http://www.smtinfo.net
Electronics Forum | Fri Dec 15 14:31:43 EST 2006 | MFG CAVEMAN
John, Search the archives for lead free BGA and you should find plenty of info.
Electronics Forum | Thu May 01 15:42:53 EDT 2008 | ck_the_flip
Yes, the authors do give the caveat that small amount of lead contamination in a SAC/Lead-Free system is tolerated provided the Pb-BGA has sufficiently reflowed. This verbiage is on the bottom of Figure 10. For my own peace-of-mind, I would send yo
Electronics Forum | Mon Apr 19 15:16:56 EDT 2004 | wgaffubar
Thanks, but the site will only allow you to access the information if you attended the conferance. Sound interesting. arcandspark
Electronics Forum | Wed Apr 05 12:27:52 EDT 2017 | emeto
the package should have nozzle(midas) and camera pre-selected(hydra camera will not work(try standard or high resolution). Odd shape recognition type will not use auto teach option(try chip, leaded, BGA.... )
Electronics Forum | Tue Jun 26 14:28:50 EDT 2007 | bjrap3
I have been trying to rework a lead-free BGA. For some reason, when I remove the BGA the corner pads on the board come off and the board must be scrapped. If I do manage to remove the BGA successfully, when I solder the BGA, the corners of the BGA
Electronics Forum | Thu Nov 03 10:33:04 EST 2005 | Samir Nagheenanajar
I've read all the SMTNet threads available on this topic, been to a couple seminars, and read some articles, and the general consensus seems to be "it can be done, but shouldn't." However, at my company, we have a Pb-Free (SAC alloy) 256 IO BGA comi
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