Electronics Forum | Tue Jun 01 19:42:46 EDT 2004 | Ken
The biggest fear is mixing the solder pastes and bar solder. Had a training program for teaching folks what the alloys are and how to read them. I have locked up the bar solder and use the buddy system to restock the pot. Put up many signs on le
Electronics Forum | Fri Jul 06 12:39:01 EDT 2007 | blnorman
What's the metallization on the board? We use an immersion tin board and had to increase our profile to successfully solder.
Electronics Forum | Tue Oct 06 07:37:01 EDT 2015 | m_imtiaz
can we use same reflow oven for lead free and leaded solder paste, is there any chance of lead contamination in lead-free products.
Electronics Forum | Wed Oct 07 13:15:06 EDT 2015 | markhoch
You can most certainly use the same reflow oven for both leaded and lead-free pastes. Obviously your thermal profiles will be different, as the lead-free paste should have a higher reflow temp. As long as your oven has adequate exhaust and flux manag
Electronics Forum | Fri Feb 11 16:58:24 EST 2005 | steve
I know this has been dealt with in the past but I couldn't dig up anything in the archives. If I'm soldering a 0402 lead free component with 63/37 solder is this a problem. Also lets take the opposite. If I'm soldering a lead bearing 0402 with lead f
Electronics Forum | Fri Jun 18 20:29:39 EDT 2004 | Ken
The problem is lead enrichment regions forming in the hottest part of the joint. The lead pool is the weakest part of the (SMT) joint. In TH interconnects hot tear or pad lift can result. I have recently seen this first hand.
Electronics Forum | Wed Jun 16 11:27:06 EDT 2004 | larryk
If you did not increase your heat to melt the lead free BGA balls, I would be very concerned.
Electronics Forum | Tue Jun 15 09:26:00 EDT 2004 | johnthor
There was a thread in the IPC TechNet a few days ago about this subject. Basic conclusion was that there is a reliablility concern if the lead free balls don't reach liquidus with the Pb profile. Haven't tried it myself. John Thorup
Electronics Forum | Sun Jun 13 08:01:50 EDT 2004 | Grant
Hi, Oops, looks as though this has already been covered in another thread. However it was not clear if anyone's done this, and if it worked ok. We only need to do a few hundred boards. Regards, Grant
Electronics Forum | Sun Jun 13 18:44:54 EDT 2004 | Ken
If the balls are SAC then you may actually reflow them at 217C. Of course, I may be assuming they are SAC...
