Electronics Forum | Mon Jan 16 04:29:33 EST 2006 | Rob
No, but Kemet were late in adopting lead free finishes in comparison to the Japanese manufacturers, some of which have been compliant for years. The finish on Kemet Chip Caps is generally Matte Tin, & I have checked with our parent company that sell
Electronics Forum | Wed Feb 21 14:14:11 EST 2007 | rgduval
Hi, Bill, Lead-free solder and paste manufacturers will be a great resource for you during the transition; they've tested their products extensively, and their application groups have been able to help me through the biggest changes. There are a fe
Electronics Forum | Thu Nov 06 10:21:38 EST 2008 | mendcorp
Does anyone have a glass dome intallation process of Silicone dome cast that can survive the standard IPC reflow profile for lead-free processes? Please shear it with us.
Electronics Forum | Wed Aug 10 10:41:23 EDT 2005 | patrickbruneel
Bob, Great theory if you're selling SN100C, but I have to disagree that an alloy being 4�C off eutectic will cause cracks. When a solder joint exits the solder wave, there is an immediate drop in temperature of 100�C. so being off 4�C is irrelevant.
Electronics Forum | Thu Mar 01 21:20:47 EST 2007 | J.R.
Let's talk pin holes and blow holes. I've been here since the transistion of leaded to lead-free process started for our company and we purchased a wave machine just to keep up with our lead-free orders. we put out 500-1000 boards a day both leaded a
Electronics Forum | Wed Oct 06 20:23:38 EDT 2021 | stephendo
If you can, it would be best to have a scrap board with a scrap BGA and drill a small hole in the bottom of the PCB and attach the thermocouple lead to a ball. This is assuming that you have a convection oven. If you have an IR oven, and that is wh
Electronics Forum | Wed Dec 22 07:20:21 EST 2010 | piter
HI I used both of solder leveling HASL and ENIG, HASL I can recommended for biger pitch is cheaper solder leveling than ENIG but problem with that solder leveling is during the reflow process HASL isn't flat and during reflow process component move
Electronics Forum | Tue Jul 24 19:26:20 EDT 2001 | johnmaetta
Thanks Dave. We develop high-speed telecom PCB assemblies that use uBGA and other fine pitch components. Our policy has been to use an NC process at our CM. Our engineering group, who is also a customer, and uses these assemblies for development,
Electronics Forum | Sat Jun 05 13:38:22 EDT 2021 | ppcbs
For Linear Tech LGA's we solder bump the LGA using a .30mm solder ball then reflow with a tacky flux. This will provide a void free solder joint and adds a little height to the solder joint in case you use a flux that you want to clean from under th
Electronics Forum | Wed Dec 22 01:39:06 EST 2010 | boardhouse
Hi Johan, As a Asian board supplier - I would not recommend using Lead free hasl on any product that has BGA, you would be just looking for issues, flatness being the main. I agree with one of the other replies - Your purchasing dept. should not be
.gif)
