Electronics Forum | Wed Nov 05 13:17:58 EST 2008 | mrmaint
Take a look at your profile. Early on in the development of our leadfree process we saw excessive voids on BGA'S. We tweeked our reflow profile and were able to bring our voids down to about 9% or less. Also found that some paste mfgs. worked better
Electronics Forum | Wed May 24 16:19:58 EDT 2006 | inds
John, there have been quite a few discussion on Mixed Assemblies in this forum.. do a search.. you will get whole lot of information.. in addition - IF you are using Lead-free reflow profile...make sure the rated temp for Sn-Pb components is not vi
Electronics Forum | Thu May 03 10:45:27 EDT 2007 | mmjm_1099
Make sure you check to see that they are not lead-free balling and using leaded profile. We had this and had continous problems. We had to send out our BGA to get reballed.
Electronics Forum | Thu Nov 06 10:21:38 EST 2008 | mendcorp
Does anyone have a glass dome intallation process of Silicone dome cast that can survive the standard IPC reflow profile for lead-free processes? Please shear it with us.
Electronics Forum | Tue Jun 17 12:38:33 EDT 2008 | john_smith
We are also using Vapor phase for our process. We currently have 6 profiles that we have established. 3 for Leaded and 3 for Leadfree. We have set-up our profiles depending on the mass of the board. We do have some tombstoning depending on several va
Electronics Forum | Tue Jan 31 12:02:22 EST 2006 | aj
how would you apply both pastes.? anyway, I have succesfully run leadfree bga with lead paste. You gotta find a profile that kinda meets both requirements. Taking into consideration the peak temp and time above. dont have details on hand but I ca
Electronics Forum | Thu Aug 17 09:38:28 EDT 2006 | pjc
Having the last two zones at the reflow temp (spike) is typically done on long ovens (10 zone) running at high conveyor speeds. This enables you to achieve peak temp and TAL as per the solderpaste specs at high production rates. Concerning reverse sp
Electronics Forum | Mon Jan 28 13:20:48 EST 2008 | tonyamenson
New to thermal profiling (leaded and lead free), and my boss wants me to search for a better profiler. Currently our model has three ports for thermal couple inputs. We are established in our noraml process but we are relatively new to incorperate m
Electronics Forum | Mon Jan 19 14:00:34 EST 2009 | jwolvans
Thank you for the customer's perspective, Alien. We actually send a short "wish-list" to our customers and includes such necessities as: 1. BOM. Must be Rev-controlled and contain, at minimum, a useable part numbering scheme, adequate description fi
Electronics Forum | Thu Nov 03 10:33:04 EST 2005 | Samir Nagheenanajar
I've read all the SMTNet threads available on this topic, been to a couple seminars, and read some articles, and the general consensus seems to be "it can be done, but shouldn't." However, at my company, we have a Pb-Free (SAC alloy) 256 IO BGA comi
