Electronics Forum: level test (Page 6 of 39)

Lead Contamination of wave solder carriers

Electronics Forum | Wed Jan 23 14:09:10 EST 2008 | lmartenson

We have carriers that we use in wave flow solderers that are machined specifically for each board out of ESD composite. I was wondering if anyone knows about lead contamination of this material and the cleaning of composite? I know that it is a p

Re: humidity in PC packages

Electronics Forum | Mon Jun 21 16:11:41 EDT 1999 | John Thorup

I am finding that some of our IC's are coming from the supplier with the humidity gauge in the bag reading 10-20%. Has anybody done any tests to determine what humidty level in a package will cause problems during reflow? Usually a proper m

Conformal Coating Issues

Electronics Forum | Fri May 18 13:08:19 EDT 2012 | blnorman

I'll chime in here as well. If you have adhesion problems, 90% of the time it's contamination on the substrate (soldermask, flux residues, cleaner residues, etc.). Like Dave said, omega meter is a test for gross cleanliness, and it's OK for process

Re: Aye aye aye. Wait Wait Wait

Electronics Forum | Wed May 27 08:46:25 EDT 1998 | Dave F

We understand that testing for ionic contamination and surface insulation resistance measure different properties. We assemble printed circuit boards for other companies. We will not get combs on 90% of the boards that we assemble.

Ionic Contaminate Testing (time or auto terminate)

Electronics Forum | Thu Sep 02 16:12:51 EDT 2004 | Mike Konrad

Hi -K We are a manufacturer of ionic contamination testers (not yours). In most cases, automatic mode is appropriate. In some instances however, you may need extra time to �release� entrapped contamination from the sample. Automatic mode is not a

SMD PPM data

Electronics Forum | Fri Aug 26 21:23:38 EDT 2005 | Jes�s Salinas

Hello , In our case we take the results from the repair station. Each test station has its own repair station so from there we count the process defects : placement and printing. The formula used to calculate PPM = DEFECTS / (PARTS PER BOARD x UNITS

solder balls

Electronics Forum | Fri Jul 20 10:35:34 EDT 2001 | slthomas

David, I've thought about doing this also with no clean boards that were poorly cleaned following a misprint (and subsequently reprinted, populated, and reflowed) but have shyed away because of the potential for damage to components from the ultraso

Pick and Place Machine Validation

Electronics Forum | Thu Mar 10 23:26:46 EST 2005 | timekey

Of course a new machine out of the box should perform at a realistic Sigma level and it's not unfair to hold a machine manufacturer true to their claims. However, even if a new machine does meet the criteria on day 1, the numbers will be constantly c

Re: un-tested assembled circuit reject rates

Electronics Forum | Tue Dec 07 14:21:41 EST 1999 | Brian W.

In my experience, the most commonly accepted theory is that 100% inspection is only 80% effective AT BEST. That means that if your inspoectors are happy, noy outside concerns, well-rested, etc, they will catch 80% of the defects. This number goes d

Solder Joint Strength Comparison

Electronics Forum | Tue Sep 04 10:48:49 EDT 2007 | lloyd

How do other people check their solder joint strength after a process change? For example, say you are getting wetting problems and you feel that a change to the reflow profile may help, or perhaps a slight change to the stencil aperture to reduce so


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