Electronics Forum | Mon Sep 13 10:39:50 EDT 2004 | Marie
Suggest looking at the packaging,is it sufficient to prevent damage to the QFP?. What way are these components stored when received?.Are the reels stored in boxes or racks?.Storage in boxes may cause damage from stacking the reels on top of each oth
Electronics Forum | Wed Nov 20 18:41:57 EST 2002 | slthomas
Here's part of what I could read: "We evaluated the influence of Lift-off (Fillet-lifting) and the influence of thermal fatigue, in this case on combination between various terminal platings of electronic components and Pb-free solder, Sn-37Pb solde
Electronics Forum | Tue Nov 29 11:45:35 EST 2016 | ttheis
I was able to repair the original power supply for the printer again with parts from another similar power supply on ebay. At first the machine didn't power up properly even though the supply voltages were all good on a volt meter when tested befor
Electronics Forum | Mon Sep 26 20:10:58 EDT 2005 | Anna
What type of alloy and at what temperature do you use for wave soldering? Do you need to modify your machine? I am using SCN but I have problem controlling my bath. Are you running on multilayer board or PTH boards? Do you face any fillet lifting
Electronics Forum | Mon Apr 19 08:50:46 EDT 1999 | J.H.
25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo
Electronics Forum | Mon Apr 19 14:38:01 EDT 1999 | Chrys Shea
25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo
Electronics Forum | Mon Apr 19 22:52:59 EDT 1999 | Dean
25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo
Electronics Forum | Thu May 04 13:16:07 EDT 2023 | tommy_magyar
If I would need to investigate this claim, I would ask the following questions: - was traceability used when this product was manufactured? - was testing mandatory when this specific product was built? - is the test covering the QFP we are talking ab
Electronics Forum | Wed Apr 21 02:53:33 EDT 1999 | Raul N.
25 PPM)! | | | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compe
Electronics Forum | Thu Jan 05 12:26:20 EST 2006 | Rob
The larger BGA's can also warp more under higher temperatures which causes ball lift, more noticable towards the edges of the package.
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