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MIRTEC to Preview the MP-520 Advanced System in Package (SiP) Inspection and Measurement System at SEMICON West 2015

Industry News | 2015-06-11 16:02:18.0

MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.

MIRTEC Corp

MIRTEC to Unveil Revolutionary Inspection Technologies for Perfect Solder Joints and 30% Productivity Boost at productronica

Industry News | 2023-11-13 12:28:17.0

MIRTEC announces the development of groundbreaking inspection technologies that it will unveil at productronica 2023, scheduled to take place Nov. 14-17 at the Messe München in Munich, Germany. The new systems address critical challenges in 3D inspection performance of solder joints, inspection speed for tall component inspections, and measurement range limitations, offering manufacturers the perfect solution for enhanced quality and productivity.

MIRTEC Corp

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

MIRTEC to Premier Its AOI Series at APEX 2008

Industry News | 2008-02-28 21:48:17.0

OXFORD, CT � February 2008 � MIRTEC a leading global supplier of AOI systems to the electronics manufacturing industry, announces that it will introduce its MV series of AOI systems in booth 1857 at the upcoming APEX exhibition & conference scheduled to take place April 1-3, 2008 in Las Vegas.

MIRTEC Corp

IPTE FlexMarker Laser Marking Machine

IPTE FlexMarker Laser Marking Machine

Used SMT Equipment | Labeling Systems

https://bajabid.hibid.com/lot/62286252/2018-ipte-flexmarker-laser-marking-machine/?q=&ref=catalog

Baja Bid

MPM Ultraprint2000

MPM Ultraprint2000

Used SMT Equipment | Screen Printers

MPM, Screen Printer, type UP 2000/B , s.n. 22256, size Approx 1,17 x 1,60 x 1,50 meters , max plate 20' x20', with CRT monitor and internal PC, CE Marked

Baja Bid

Feinfocus FXS160/31

Feinfocus FXS160/31

Used SMT Equipment | Visual Inspection

FEIN FOCUS, X Ray inspection machine, type FXS160/31, s.n. 14000020 666, out of order for maintenance, size approx.1,60x1,70x2,40 meters, year 1998, CE Marked

Baja Bid

Orbotech Trion 2340

Orbotech Trion 2340

Used SMT Equipment | AOI / Automated Optical Inspection

ORBOTECH, Visual inspection machine, type TRION 2340, SN: 3800238, with 3D edge detection, included DELL PC inside and flat monitor HP, size approx. 1,20x1,25x,1,60 meters, year 2000, CE Marked

Baja Bid

Assembleon Opal XII

Assembleon Opal XII

Used SMT Equipment | Pick and Place/Feeders

Assembleon Opal X II SMT Pick & Place Type: PA131404 NC: 946601314041 This lot also includes: (20) 8mm OPAL FEEDERS Serial: FFPB709Y10257 Features: 8-Head Hours: 19452 200-416V 3 Phase AC 50/60Hz 4.4KVA CE Marked Note: Machine uses mechan

Baja Bid

Fuji QP242E

Fuji QP242E

Used SMT Equipment | SMT Equipment

FUJI, Modular Pick&Place Machine,with unique logic module QP242E-ICM-101, 5 modules total, with 4 feeders support, 31 slots/each, 1 trays slot for 20 related plate, for both electronic or mechanic feeders, 48.618 working hours, software version 3

Baja Bid


mark searches for Companies, Equipment, Machines, Suppliers & Information

Pillarhouse USA for handload Selective Soldering Needs

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World's Best Reflow Oven Customizable for Unique Applications
SMT feeders

Easily dispense fine pitch components with ±25µm positioning accuracy.
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