Electronics Forum: melting and leadfree (Page 6 of 25)

Time and temp in lead and lead-free reflow

Electronics Forum | Fri Aug 01 21:10:35 EDT 2008 | leo_dektec

You can keep only the 5th zone as the reflow zone. And lower the first two zones to keep a good ramping rate. Meanwhile,please note the ting temperature in software or control panel is not the exact temperature in your PCB, you'd better get a KIC or

Time and temp in lead and lead-free reflow

Electronics Forum | Sat Aug 02 08:06:11 EDT 2008 | pcbbuilders

Is there a limit to the time that most components can stay at temperatures around 130-200 deg c? if i slow the time, the first 4 zones will be at this temp for about 5 minutes in no lead process. i am concerned that some chips wont be rated at this t

01005 components and reflow profiles

Electronics Forum | Mon Apr 09 20:55:46 EDT 2012 | action_101

I forgot to add that we are using a 3 mil stencil. It seems like to me that may be there isn't enough flux left when we reach liquidous?? About half of the solder spheres do melt and wet on each pad, but the top half of each solder joint is just the

Leaded and Lead-Free Wave Parameters

Electronics Forum | Wed May 21 08:16:57 EDT 2008 | tonyamenson

Good morning gentlemen, I could use some advise as to the min / max windows for the wave process. We have had little problems with our leaded wave but when applying the same process to lead-free wave we are having problems. Obvisouly the temps are

Vitronics Unitherm 500 and Leadfree

Electronics Forum | Thu Mar 24 09:53:03 EST 2005 | aj

Doug, We are getting ready to do some trials at the moment. I have profiled the oven and achieved the Required Temps. that would be desirable. I dont envisage any problems what so ever aslong as who ever is doing the profile fully understands the

Printer and Reflow Oven Recommendations

Electronics Forum | Tue May 19 13:29:33 EDT 2015 | dyoungquist

We have been running a Heller 1707EXL for 8 years and added a Heller 1707MKIII about 1 years ago. We have not had any problems with either one of them. We do both lead and lead-free assemblies along with BGA/LGA components. If speed/volume is not

Time and temp in lead and lead-free reflow

Electronics Forum | Mon Jul 28 14:30:22 EDT 2008 | grics

Take a look at this. Remember, these are only guidlines and can not replace any paste specs. As Real Chunks said, a profiler will be of HUGE help. We use this to determine what our top side temps are and to see if we have any problems with heat sen

Time and temp in lead and lead-free reflow

Electronics Forum | Fri Jul 25 15:54:22 EDT 2008 | pcbbuilders

I am trying to optimize my reflow profile. i have a 5 zone oven. lead-free: for the 1st 3 zones, i am good, at about 150-200 deg for 150 seconds. during the 4th zone, i am at a temp of 200-220 for 50 seconds. during the 5th zone, i am at 220-245 f

Re: When? How and What??

Electronics Forum | Tue Aug 22 10:47:28 EDT 2000 | Dr. Ning-Cheng Lee

The European WEEE has issued a new (5th) version of its recommendations. In it they say that , on January 1st, 2004, they will review the status of the Pb-Free issue. There is currently NO DEADLINE for implementation. As far as a direct replacemen

01005 components and reflow profiles

Electronics Forum | Tue Apr 10 04:16:20 EDT 2012 | grahamcooper22

you are seeing a typical issue that is caused when such small volumes of paste are printed....there are several reasons for it..the tiny amount of flux in the small deposit becomes exhausted much quicker then it does in a larger deposit ( the flux ma


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