Electronics Forum | Tue Jun 15 13:36:30 EDT 2004 | John S
We are launching a new product and are fairly new to reflow soldering. A concern that has arisen is a fairly consistent solder ball that forms at an electrolytic capacitor. We changed to a homebase aperture design on our passives to eliminate mid-c
Electronics Forum | Sat Aug 07 11:47:47 EDT 1999 | JohnW
| | | | | | | | | | | | Hello, | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chi
Electronics Forum | Tue Feb 19 11:34:04 EST 2002 | AndyC
Do you mean middle height slice ? . This is a term used to describe the x-ray taken at a mid-ball position on a BGA ball , ie , the "fattest/widest" part if the ball . This is generally done to see if voids contained within have led to fracture acros
Electronics Forum | Tue Nov 05 09:21:18 EST 2002 | stefwitt
After all, you may want to consider a Flip Chip process. The chips are bumped with tiny solder balls while still on the wafer. You may present the bumped chips in Gel Pack, trays or Surftape to your Pick $ Place machine ( if capable for Flip Chip pl
Electronics Forum | Thu May 26 16:41:00 EDT 2011 | scottp
Here's what I do: - Test Surface Insulation Resistance (we're in the high reliability market and use a test significantly harder than IPC's). I also test SIR in combination with other assembly materials like conformal coatings and wave solder flux
Electronics Forum | Fri Aug 04 09:09:22 EDT 2006 | russ
Aj is right, utilize the homeplate aperture, this reduces the amount of paste actually underneath the component, Pb frees exhibit this mid ship more often than the lead, I think,it is mostly because of thre transition to noclean form water solubles
Electronics Forum | Thu Jul 10 02:49:34 EDT 2003 | emeto
Hi! One technique: 1. Remove all balls 2.Make a mask(stensil)for reballing.The holes of the mask must be 0.8-0.9 the size of the pads. 3. Reball chips 4. Reflow chips Good luck
Electronics Forum | Wed Aug 05 11:08:36 EDT 2009 | spitkis2
Hi, This may be a bit off the subject but thought I'd ask just in case. I am looking to identify a process / equipment for attaching solder balls to flip chips. Solder balls are 75 microns in diameter. With BGA's there are reballing kits that use
Electronics Forum | Fri May 05 15:02:28 EDT 2006 | adlsmt
If 15 to 18 chips per hour is fine, I would put them down by hand. If your useage goes up dramatically, I would look at the top end machines. The prices from the big guys have come way down and its not worth buying a mid market machine anymore.
Electronics Forum | Wed Jul 14 16:03:25 EDT 2010 | malcolmlanders
I seemed to have learned that on the bga chip that the soider is the soider balls on the chip. If this is true how do you get the chip to not move on the board when being inspected bdfore you soider it. and even in the transport of the board to the o
