Technical Library | 2019-05-21 17:34:08.0
Flip chip components have been gaining popularity in the electronics industry since their introduction in the 1960s. Advances in attach methods and adhesives, as well as the drive for smaller and faster electronic devices made the technology take off. The basic premise of the flip chip is that the chip (semiconductor device) is mounted flipped from the traditional position. The traditional method of mounting a die is to mount it on a lead frame with the circuit and bond pads face up. The bond pads then receive a bond wire which then connects to the proper lead on the lead frame. Flip chips are mounted face down onto a substrate using small bumps on the bond pads to make direct electrical connection to their respective pads on the substrate. Stay tuned for more information on attachment techniques next month. This article will focus on how to rework flip chips.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Used SMT Equipment | Pick and Place/Feeders
1. Mounting speed: 30000CPH (IPC standard) 2. Number of feeders: 140 3. Number of mounting heads: 12 4. Mounting size: 330mm x 250mm 5. Size range: 0402MM ~ 50mm x 100mm square device 6. Component height: 15mm 7. Mounting accuracy: ±30&m
Used SMT Equipment | Pick and Place/Feeders
1. Mounting speed: 30000CPH (IPC standard) 2. Number of feeders: 140 3. Number of mounting heads: 12 4. Mounting size: 330mm x 250mm 5. Size range: 0402MM ~ 50mm x 100mm square device 6. Component height: 15mm 7. Mounting accuracy: ±30&m
1. Mounting speed: 30000CPH (IPC standard) 2. Number of feeders: 140 3. Number of mounting heads: 12 4. Mounting size: 330mm x 250mm 5. Size range: 0402MM ~ 50mm x 100mm square device 6. Component height: 15mm 7. Mounting accuracy: ±30&m
1. Mounting speed: 30000CPH (IPC standard) 2. Number of feeders: 140 3. Number of mounting heads: 12 4. Mounting size: 330mm x 250mm 5. Size range: 0402MM ~ 50mm x 100mm square device 6. Component height: 15mm 7. Mounting accuracy: ±30&m
A power supply is a device that converts other forms of energy into electrical energy and supplies electrical energy to a circuit (electronic device). It provides the electrical energy needed by all the components in a computer. The size of power sup
Industry News | 2018-08-21 14:28:35.0
Clariant's new Humitector Type 2 Non-Reversible Humidity Indicator Cards contain a patent-pending non-reversible 60% humidity spot indicator which enables them to indicate whether dry packed surface mount devices (SMDs) have been exposed to high levels of moisture at any point during shipment or storage. This unique innovation offers a major step forward in preventing moisture-compromised surface mounts from entering production.
A Sustainable Alternative - Humitector cards are halogen-free and cobalt dichloride free. Visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-humidity-indicator-card?utm_source=CLRYouTube&utm_medium=Vi
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
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Phone: 952-920-7682
