Electronics Forum | Mon Aug 14 13:51:37 EDT 2023 | calebcsmt
I'm actually currently in the process of discussing with stencil MFG regarding the apertures and reduction to see if perhaps it was not optimal for this fine pitch QFN, as just as you mentioned, we have similar products with similar QFNs that do not
Electronics Forum | Mon Aug 14 14:17:19 EDT 2023 | emeto
Now you have to find the root cause, before you continue. Is it PCB design or printer setup? Or both contribute?
Electronics Forum | Wed Aug 23 17:22:39 EDT 2023 | markhoch
I'm curious what you use for PCB Support. Are you using a dedicated support plate or are you using magnetic pins or some type of Grid-Lock system?
Electronics Forum | Wed Aug 23 17:43:42 EDT 2023 | calebcsmt
Support bars, so essentially the board is sitting ontop of beams that make a table. Fully supported with no soft spots
Electronics Forum | Tue Sep 17 15:03:33 EDT 2002 | ccross
I am working with fine pitch components (15-20 mil) and having soldering problems and would appreciate some opinions. 1) How much of an effect does pad size have on bridging? 2) How much of an effect does solder paste grain size have? What is the re
Electronics Forum | Mon Aug 14 12:06:18 EDT 2023 | calebcsmt
Please elaborate, as I have already tried to rule out printer setup. 0 contact of course, ive tried a multitude of pressures, separation speeds, cleaning frequency. Moreover, i use these settings for similar stencils and have absolutely no issue
Electronics Forum | Sun Apr 16 14:37:25 EDT 2000 | Roberto Navarro
Hi, I work for Nortel and here rework BGA'S we use DRS22 rework station and CRT 2000 X-ray inspection. The main problem is put again the BGA on the PCB because you need reboling the PCB and you could damage the soldermask. Talking about Air-vac is ve
Electronics Forum | Tue Mar 09 18:21:37 EST 1999 | Stan Levitsky
We will wave solder a board with SOIC14 and SOIC16 parts on the bottom. It has been difficult to find any specific wave solder process recommendations from manufacturers of the SOICs. The pad geometry utilizes theiving pads on both sides to reduce br
Electronics Forum | Thu Sep 19 11:14:45 EDT 2002 | Jim M.
We had lots of problems with bridging on 15.8mm pitch, QFP17-160 at the start.The board was .032 thick, double sided-six boards to a panel. Here is the problems (not neccessarily in the biggest to little but as i remember them) and solutions that he
Electronics Forum | Mon Sep 23 10:45:34 EDT 2019 | slthomas
I have seen similar things happen with over etching and bridging but frankly the most common mistake that gives us grief is a failure to use the component manufacturer's recommended land pattern and/or aperture designs. As opposed to generating a n
