Electronics Forum | Mon Aug 03 04:51:58 EDT 2009 | lococost
From alpha metals lead free alloy impurities bulletin: "Levels greater than 0.025% may start to slow the wetting speed and could affect the hole fill performance. If process performance is OK then levels up to 0.05% are OK."
Electronics Forum | Mon Aug 03 12:04:39 EDT 2009 | davef
Loco: Your post seems to be pasted from a Alpha Metals SACX0807 application sheet. We don't understand the relationship between your SACX0807 and Hoss67 SN100C. They're different alloys.
Electronics Forum | Thu Aug 06 05:57:10 EDT 2009 | lococost
Indeed Dave, But I can't image the extra .5% silver that alpha adds to sn100c will make a huge impact on the difference between the behaviour of the 2 alloys, especially considering SAC gets exactly the same recommendation.
Electronics Forum | Wed Feb 08 03:44:28 EST 2006 | fctassembly
Hello Amol, I continue to be amazed at the surprise engineers have on discovering that a non-eutectic alloy such as SAC305 displays micro-cracking and rough joints in a soldering process. There was a reason the electronics industry chose to use eutec
Electronics Forum | Sun Feb 05 08:41:15 EST 2006 | Cmiller
Are you refering to reflow soldering or wave soldering? Brian, do you have any data to support that SAC305 is more reliable than Tin-Copper-Nickel? NEMI reccomended SAC type alloys for reflow and Tin-Copper for wave. See: http://circuitsassembly.
Electronics Forum | Mon Dec 20 21:01:12 EST 2004 | davef
Bare inconel is NOT ment to take solder, because * Nickel develops a tenacious oxide layer that is very difficult to remove since the nature of the oxide is very dense, coherent, etc. * Chromium is difficult to solder. * Iron is difficult to solder.
Electronics Forum | Tue Mar 28 13:29:45 EST 2006 | solderiron
SN100C, not as aggressive towards other metals as are other High tin lead free alloys. Why? Sn63/pb37 The lead prevented the tin from being very aggressive. SAC305 no lead, silver instead. Silver doesnt block Tin from it's aggresiveness. SN100C no si
Electronics Forum | Mon Oct 25 21:49:14 EDT 2004 | davef
First, any results of pull or shear tests are unscientific at best. [We pop our BGA from boards with, appropriately enough, a beverage can opener.] Second, we have no have problems with your ENIG specification. Third, as with your customer, we'd e
Electronics Forum | Tue Jul 05 11:00:37 EDT 2005 | patrickbruneel
Inds, This will happen with all lead-free alloys having a tin content above 70%. It takes about 30 sec. for a molten lead-free alloy to totally dissolve a copper pad. The higher the temperature the shorter the time and visa versa. The scary part of
Electronics Forum | Sat May 28 06:43:03 EDT 2005 | steve
I have the ability to offer both SAC and SN100C lead free alloys to my customer base. What might occur if a customer is already using SAC305 in their wave and they want to save money and go to SN100C. They now are mixing, tin,silver,copper with tin,c
