Electronics Forum | Fri Jun 18 20:29:39 EDT 2004 | Ken
The problem is lead enrichment regions forming in the hottest part of the joint. The lead pool is the weakest part of the (SMT) joint. In TH interconnects hot tear or pad lift can result. I have recently seen this first hand.
Electronics Forum | Wed Jun 16 11:27:06 EDT 2004 | larryk
If you did not increase your heat to melt the lead free BGA balls, I would be very concerned.
Electronics Forum | Tue Jun 15 09:26:00 EDT 2004 | johnthor
There was a thread in the IPC TechNet a few days ago about this subject. Basic conclusion was that there is a reliablility concern if the lead free balls don't reach liquidus with the Pb profile. Haven't tried it myself. John Thorup
Electronics Forum | Tue Jun 15 03:24:56 EDT 2004 | Grant
Hi, Great, and thanks for the info, it's a big help to know someone's actually done it, and so we will give it a try on a few dozen product, and see what happens! Thanks again for the reply! Regards, Grant
Electronics Forum | Sun Jun 13 08:01:50 EDT 2004 | Grant
Hi, Oops, looks as though this has already been covered in another thread. However it was not clear if anyone's done this, and if it worked ok. We only need to do a few hundred boards. Regards, Grant
Electronics Forum | Thu Jun 17 18:52:57 EDT 2004 | Grant
Hi, I agree, and this is why I wondered what peoples experiences were, and it is a bit confusing. Regards, Grant
Electronics Forum | Fri Jun 18 14:33:53 EDT 2004 | timo
Shouldn't be a problem. The issue is when we go to Pb-Free pastes with Pb-bearing components.
Electronics Forum | Sun Jun 13 18:44:54 EDT 2004 | Ken
If the balls are SAC then you may actually reflow them at 217C. Of course, I may be assuming they are SAC...
Electronics Forum | Mon Jun 14 14:53:43 EDT 2004 | russ
Yes you can, we have done it for years. Russ
Electronics Forum | Tue Jun 15 11:04:04 EDT 2004 | russ
John, is this regarding any certain alloy of the ball? Thanks
