Technical Library | 2018-11-20 21:33:57.0
There are several industry-accepted methods for determining the reliability of flux residues after assembly. The recommended methods of test sample preparation do not always closely mimic the thermal cycle experienced by an assembly. Therefore, extraction from actual assemblies has become a popular method of process control to assess consistency of post-reflow cleanliness. Every method of post-reflow flux residue characterization will depend on the reflow process followed to prepare the coupon.This investigation will focus on the effect of thermal conditions on the remainder of active ingredients in flux residues after assembly with no-clean solder pastes.
New Equipment | Test Equipment
PROCESS SCIENCES, INC. (PSI) Visit our main Ion Chromatography page for more information. Ion Chromatography analysis (IC) is an essential tool for both failure analysis and process validation. PSI uses IC to investigate surface contamination and m
New Equipment | Cleaning Agents
IONOX FCR is a high-strength, concentrated cleaner containing a blend of organic solvents and inhibitors. FCR is engineered to remove organic acid, rosin and no-clean flux residues from electronic assemblies, advanced packages, hybrid and SMT substra
New Equipment | Cleaning Equipment
Zero Ion Ionic Contamination Tester Today's Zero Ion is designed to meet the cleanliness testing challenges associated with modern circuit assemblies. The Zero Ion is capable of extracting and quantifying assembly contamination levels per IPC J STD0
Industry News | 2009-04-23 20:43:27.0
RANCHO CUCAMONGA, CA � April 2009 � Aqueous Technologies Corp. announces the publication of its newest video presentation, �An Introduction to the Zero-Ion G3 Ionic Contamination Tester.�
New Equipment | Cleaning Agents
AQUANOX® A4625 is a versatile aqueous cleaning chemistry designed to clean the latest lead-free residues while providing brilliant mirrored solder finishes. Easy to use, AQUANOX® A4625 is environmentally friendly, has a long tank life and is safe fo
New Equipment | Cleaning Agents
Broad Spectrum Electronics Cleaning Solvent IONOX® I3302 is a semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux, as well as other common electronic assembly residues.
New Equipment | Cleaning Agents
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302
Industry News | 2010-02-23 16:19:05.0
RANCHO CUCAMONGA, CA — February 2010 — Aqueous Technologies Corporation, North America’s largest provider of batch defluxing systems, and Technical Resources Corporation announce that they will host a one-day free seminar on the subject of cleaning/defluxing.
Industry News | 2016-09-07 18:44:03.0
KYZEN announces that Dr. Mike Bixenman will present the recent paper entitled, “Reactivity of No-Clean Flux Residues Trapped Under Bottom Terminated Components” during SMTA International. The paper is co-authored by Bruno Tolla, Ph.D., Jennifer Allen and Kyle Loomis from Kester and will be presented during the “Flux, Solder, Adhesives Track” on Tuesday, September 27, 2016 at 3 p.m.
