Electronics Forum: non and wettign (Page 6 of 10)

Re: Moisture Sensitivity and Package Cracking

Electronics Forum | Mon Jan 25 21:14:08 EST 1999 | Dave F

Greetings, We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? What about those components which come on blister tape, should they get baked and r

Your opinion about RoHS and WEEE ?

Electronics Forum | Tue Jan 11 15:01:27 EST 2005 | patrickbruneel

I'm not a politician but it sure looks like protectionism and a short-term economy boost for Europe. Don't forget that lead-free for the electronics is a European directive, USA and other countries (exept for japan) have non of this on there agenda (

Jedec Trays and tubes to recycle

Electronics Forum | Mon Feb 26 10:02:27 EST 2007 | Cal

Pay Recyclers: Ecological Technologies, Inc. 1230 Oakmead Parkway, #308 Sunnyvale, California 94085 U.S.A Phone: 408.524.7100 ;Fax: 408.524.7103 http://www.eco-tech.com/index.shtml OR The SemiCycle Foundation 2111 Kramer Lane Austin, Texas 78758

Kester R562 and using lead free components

Electronics Forum | Fri Jul 06 13:44:15 EDT 2007 | shrek

Krikies! seems like a head-scratcher if I may say so me-self. I would say the other ogre is right, that surface finish will play a big factor in your solder joint's grain structure or how shiney 'tis. Non-HASL bearing finishes will typicaly exhibit

Re: Ionic testing and No-Clean flux

Electronics Forum | Sat Feb 05 09:08:18 EST 2000 | Dave F

Casimir: Let me expand on something that I said in my response to your thread on ionic testing. Generally, no-clean people don�t use ROSE testing as part of their process control, because the ROSE test is essentially washing your board in DI/IPA �

Re: qfp and soic joint Problem

Electronics Forum | Tue Apr 11 20:26:16 EDT 2000 | Dave F

Jeremy: Parts assembler make leads of either Alloy 42 (Invar, whatever) or copper. The solderability of these leads are protected with eutectic or non-eutectic tin/lead solder, palladium or some palladium alloy, or gold. Cuppla things to consider:

Re: x,y digitizer and optical comparator

Electronics Forum | Sun Feb 17 15:17:34 EST 2002 | JLeonard

I can understand that you really don't like a non-techie to post a reply/comment to the SMTNet forums. After all, it's always been about the technology/techs and not the sales folk. But what happens when a 'techie' provides incorrect or blatantly fa

paste release from stencil, and volume calculation

Electronics Forum | Sun Nov 07 10:54:21 EST 1999 | Steve Thomas

We're looking at redesigning our stencils to facilitate better (well, it's pretty much non-existant, so any improvement is a big leap) release from fine pitch apertures. Currently we have perpendicular walled laser cut apertures. We'll be having

Re: Moisture Sensitivity and Package Cracking

Electronics Forum | Mon Feb 01 10:06:51 EST 1999 | Chris Fontaine

All of our moisture sensitive components are shipped to us in vacuum sealed, desiccated bags with a moisture indicator. When the parts are removed from the bag (this is done at either SMT setup, or in the stockroom) the indicator is checked. If it

Lead Free and Leaded Process Mix

Electronics Forum | Mon Jun 27 09:09:19 EDT 2005 | Bob R.

We've all been soldering Pb free parts for a couple decades. All your surface mount capacitors have probably had a Sn finish for years. Whenever one of our parts with a SnPb finish converts for Pb free we have the manufacturing site do a small buil


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