Electronics Forum | Thu Jun 19 20:47:57 EDT 2003 | davef
Your solders could have vasty different liquidous points. Check with your suppliers to determine the appropriateness of the materials you have selected. Awhile ago Jim Zanolli at Teka hosted an OnBoard Forum here at SMTnet. He'd be happy to give y
Electronics Forum | Tue Jul 22 06:41:40 EDT 2003 | davef
bga void doe * Dr. Lee at Indium Corp. has conducted a number of investigations concerning solder joint voiding and BGA components. Check Indium's site. [As an aside, Lee's book "Reflow Soldering Processing and Troubleshooting SMT, BGA, CSP and Flip
Electronics Forum | Tue Aug 12 15:30:50 EDT 2003 | larryk
With components all switching to lead free, I'm just wondering how many of you in the US have switched to lead free soldering processes? How many of you are playing with lead free and have a plan to implement it into your process? I'm interested in
Electronics Forum | Mon Apr 05 13:23:07 EDT 2004 | Ron W
Low-consumption Nitrogen configurations with an on-board O2 analyzer is the ideal way to go. I cannot speak for all oven manufacturers, but ours have N2 fed to the reflow zone only, which to me is really only where you need it. The gauges/flowmeters
Electronics Forum | Thu Dec 23 02:56:14 EST 2004 | Steve Stach
Are you aware of Austin American Technology's "Mega" process. It combines MegaSolv chemistry with the Mega II cleaning system. MegaSolv is a single non-aqueous solvent which is deionized by the Mega thru a special solvent compatible mixed bed on-bo
Electronics Forum | Sat Oct 29 21:24:30 EDT 2005 | Paul Standeven
The CSM84 family units are 3 headed pick & place machines with mechanical chuck centering technology. They use a beam pointer for fiducial correction. The CSM84V is the same as the CSM84 but has a downward looking fiducial camera onboard in lieu of
Electronics Forum | Fri Apr 27 13:02:47 EDT 2007 | Cal
MY FAV: http://www.circuitree.com/ Europe: http://www.epp-online.de/epp/live/start/6.html http://www.evertiq.com/newsx/default.aspx http://www.onboard-technology.com/ Other: http://www.assemblymag.com/ www.chipscalereview.com www.pcb007.com h
Electronics Forum | Thu Aug 13 12:23:39 EDT 2009 | robhs
Thanks Dave. What you say makes complete sense. We ran a job a short while back in this way (though without bonding) and found we had a much higher than normal failure of the BGAs which I can only attribute to the secondary reflow. As I have only got
Electronics Forum | Fri Oct 02 09:22:24 EDT 2015 | derrikf
The following is representative of on-board temps of a FR4 at .069" thickness. The thermal couples were soldered directly to the board using high-temp solder. Again, the halogen-free solder requires an identical profile to our old solder. We had grea
Electronics Forum | Wed Jun 24 21:58:16 EDT 2020 | kumarb
Thanks Rob. They want to sell us a new TDM which does not sound correct as the entire TDM is with an offset. Logic is making us believe that the calibrated data is stored inside the onboard microwire eeprom. Do not know the format of these expected v
