Electronics Forum: oven and profile (Page 6 of 183)

Intermetallics and reflow profile

Electronics Forum | Tue May 02 15:29:14 EDT 2000 | M. F. Roe

I am looking for public papers or articles on intermetallic formation as a function of reflow profile. Most solder paste vendors specify peak temperature and time above liquidus, but I am particularly interested in what happens to intermetallic grow

reflow profile

Electronics Forum | Tue Feb 19 12:28:26 EST 2019 | slthomas

Presumably you're talking about lead free, but you don't say. Heller can probably provide you with a starting point, as rob has already pointed out, but you do need to develop the capability to perform profiling yourself. That oven should have ECD

reflow profile

Electronics Forum | Sat Sep 22 09:07:56 EDT 2001 | davef

Back-stepping a bit. If a profile is being used to: * Set-up the oven for a new product or trouble-shooting process, the profile should be taken with a solid contact to a solder connection. * Monitoring on-going stable and in-control process that re

optimized profile

Electronics Forum | Sun Apr 25 09:45:13 EDT 1999 | Joe Cameron

Hello all, Our guys here still have some questions on the "optimized" profile which sees a more moderate ramp up straight to reflow temperatures versus the conventional profile which has a plateau at around 150 Celsius. If the optimized profile can

reflow profile

Electronics Forum | Sat Sep 22 14:33:50 EDT 2001 | Tony

I like to secure the thermalcouples with a small dot of chip-bonder(surface mount adhesive). The chip-bonder will cure durring the first pass through the oven. After I have developed my profile I remove thermalcouples and the chip-bonder with a solde

reflow profile

Electronics Forum | Wed Feb 20 11:40:31 EST 2019 | bmalhi

Heller Oven comes with a profile pre-loaded so you can start there. RTS = Ramp to Spike. Basically a straight line from preheat to spike. Also known as “Tent” profile RSS = Ramp Soak Spike. This one creates a flat line around 150-180 degrees on th

reflow profile

Electronics Forum | Tue Feb 19 10:50:13 EST 2019 | rgduval

Call Heller directly, and give them the oven, and relative thermal density of the board, as well as the solder paste that you're using. They'll be able to give you a baseline profile to start from (both RTS and RSS). Otherwise, use a thermocouple p

BTU profile

Electronics Forum | Tue Aug 13 20:54:48 EDT 2002 | davef

The major profiler companies [ie, KIC, ECD, etc] give away FREE Excel spread sheets that list everyone's oven and paste and allow you to input board characteristics and then it suggests a profile. Go get one.

SMT BGA capable oven and stencil printer.

Electronics Forum | Tue Nov 20 17:07:20 EST 2007 | kennyrebbe

I am looking for a new semi automatic Stencil printer, and reflow oven that is capable of doing double sided boards with BGA�s. We currently own a Manncorp 4500R stencil printer https://www.manncorp.com/4x00_stencil_printers/index.php?view=overview&a

Re: Intermetallics and reflow profile

Electronics Forum | Wed May 03 20:24:22 EDT 2000 | Dave F

MF: I know of nothing that addresses your question directly. Let me suggest: * Technical types at your solder supplier should be able to help. * "Effect Of Intermetallic Compounds On The Thermal Fatigue Of Surface Mount Solder Joints" PL Tu, et a


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