Electronics Forum: overprint and solder and stencil (Page 6 of 15)

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Dec 11 06:34:24 EST 2019 | ameenullakhan

Hi Everyone, Reducing the top heaters around 10 deg each at last 3 zones of reflow oven. Helped us in achieved little lesser temperature at top connection of the CCGA. And we didn't face any bent. Bridging : Reducing the stencil aperture , has wor

Stencil Bleed - Bridges and Solder Balls

Electronics Forum | Mon Aug 14 12:06:18 EDT 2023 | calebcsmt

Please elaborate, as I have already tried to rule out printer setup. 0 contact of course, ive tried a multitude of pressures, separation speeds, cleaning frequency. Moreover, i use these settings for similar stencils and have absolutely no issue

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 19:43:12 EDT 2002 | dragonslayr

One more variable I've remembered - pad height with respect to solder mask height. Pads being too low can cause stencil "gasketing" problems that in turn allow more paste to be deposited than needed. Are your fabs HASL or some other media?

Solder Paste and fine pitch components

Electronics Forum | Fri Sep 20 04:47:29 EDT 2002 | byates

If I were you I would contact your solder paste applications engineer and your stencil applications eng. They are there for this very reason and are very capable

Solder beads on small caps and res.

Electronics Forum | Wed Nov 29 14:49:38 EST 2006 | MS

Any recommendation to reduce solder beads next to 0402, 0603 and 0805 caps and res? What about home plate vs. bow tie stencil aperture design?

Component pad design and volume requirements

Electronics Forum | Tue Feb 15 14:35:41 EST 2000 | Balas

hi I am designing a test vehicle with a range of components on it(pbga, cbga,fc, mbga, and qfps). My concern is that I would like to use a single stencil for solder deposition and not a stepped stencil. That would require me to have aperture design a

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 12:35:56 EDT 2002 | stepheno

Fourth - > back to design of PCB. Are there solder dams of > mask between the pads? If yes, that helps. If > not, pay close attention to stencil aperture > width and be sure that the aperture deposits less > paste by 1-2 mils per pad, centered o

Solder beads on small caps and res.

Electronics Forum | Wed Nov 29 17:00:40 EST 2006 | John S.

We've used both effectively to resolve this issue. Check with your stencil manufacturer. Often, they can give you a very good starting place on issues like this since they see everyone's designs. John S.

Stencil Bleed - Bridges and Solder Balls

Electronics Forum | Mon Aug 14 13:21:48 EDT 2023 | calebcsmt

the implication being the soldermask is too thick, raising the top of the board higher than the pads themselves (eliminating gasketing)? Essentially, the board isn't perfectly planar would be the subject of cause it sounds like?

Stencil Bleed - Bridges and Solder Balls

Electronics Forum | Mon Aug 14 14:17:19 EDT 2023 | emeto

Now you have to find the root cause, before you continue. Is it PCB design or printer setup? Or both contribute?


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