Electronics Forum | Thu Mar 17 10:34:34 EST 2005 | Rob
Or... If you have an inline glue dispensor, after printing put a glue dot in the centre of the footprint & this should hold it. Rob.
Electronics Forum | Mon Oct 02 05:45:41 EDT 2006 | Thomas
Hello, Have anyone of you any experience of mounting BGA-s on both side of the PCB in lead free process? Have you seen any problems after the second reflow? Is it something special to focus on? /Thomas
Electronics Forum | Fri Sep 12 16:56:13 EDT 2008 | ppcbs
We have a double sided board with Immersion Silver Plating. After reflow the Silver turns a yellowish color. It still wets good, and the yellow color will polish off with a pencil eraser. Has anyone seen this, or know the cause?
Electronics Forum | Fri Nov 22 17:55:39 EST 2002 | robertorre
Your problem may be related to different aspects. 1. Oxidation on landing pads. 2. Either high(To long over liquidous temp) or low temp. 3. Bad solder (not enough vehicles) Run this test: Set a hot plate to 220 degrees C. Make sure you have proper ve
Electronics Forum | Fri Aug 06 11:36:15 EDT 2004 | russ
I see how that works in your shop, I was thinking of when you have someone else do it for you and then both sides would have to be done at the same time and then double reflow isn't very viable with out glue. How do you flatten the solder after refl
Electronics Forum | Thu Oct 29 20:19:43 EDT 2009 | 89jeong
Hi. We are doing Au bonding on Al bond pad not Au plated. If pull strength is less than 2.0g, i think that the ball or stich may be lifted from bond pad. And the value become lower after several reflow. I expect that the surface of bond pad may be c
Electronics Forum | Thu Mar 02 07:38:58 EST 2000 | Roni Haviv
Hello, I had experienced this kind of problem; Because the Au film is very thin (flash gold..) it is sometimes porositive and the Ni barrier below get Oxidation. After reflow there seems to be good solder fillets (visualy perfect!) but the leads wit
Electronics Forum | Thu Mar 02 07:38:58 EST 2000 | Roni Haviv
Hello, I had experienced this kind of problem; Because the Au film is very thin (flash gold..) it is sometimes porositive and the Ni barrier below get Oxidation. After reflow there seems to be good solder fillets (visualy perfect!) but the leads wit
Electronics Forum | Thu Mar 28 11:06:49 EST 2002 | Tony Fox
Our company carries out this service for major OEM and CEM's Our web site address is http://www.retronix.co.uk Every device after it has been re-tinned gose throught a vision inspection system were it is inspected for coplinarity etc, we also re-ball
Electronics Forum | Wed Jul 16 09:55:05 EDT 2003 | swagner
To answer the first post after my initial response we haven't published any of our lead free data since it is proprietary, sorry. As for the nitrogen cabinet it has been proven that over time the Gold plating can build up a layer of oxides that can
