Electronics Forum | Thu Jun 08 23:26:28 EDT 2006 | Shawn Vike
We are a small company, reletivly new to doing our own SMT (1 year) and we are having an issue, I think. We manufacture many board with no problems, but we have one that constently defeats us. This particular PCB has ENIG finish, and we have had th
Electronics Forum | Fri Oct 27 10:35:36 EDT 2000 | Chris
We are having problems soldering this motorola part(XPC860TZP50B5). After reflow, some of the balls appear to be sitting on the reflowed paste rather than wetted to it. We reviewed parts and found oxidation on many. We have four other BGA's, from oth
Electronics Forum | Fri Nov 09 10:37:38 EST 2007 | devajj
We have started using QFN packages in large volume and are having problems with no-solders. We are using 6mil stencil with 1x1 paste print to pad. These also have thermal pads with thru vias that we reduce the stencil aperture by 1/4. Board also ha
Electronics Forum | Fri Jul 11 15:47:54 EDT 2008 | hegemon
We used these same type of parameters regardless of the QFN package size. We used componentes that ranged from 3x3mm to 12x12mm Same idea. The reduction in solder paste for the center pad is the key. Too much, and you wind up with no connects at the
Electronics Forum | Fri Jul 10 11:10:16 EDT 1998 | Boris Akselrud
Hi all, I am new to SMT. In past I've made many PCB boards with my small hands at home, but I've used regular technology drilling the holes for the components. I am trying to use SMT for my projects. SOP packages I was able to solder using a regular
Electronics Forum | Sat Nov 10 21:15:04 EST 2007 | mika
make 4 square rounded corner apertures around the ground pad and the total reduction of 20 % (80 % solder paste). Then you still be able to solder the terminals around. We SMT-mount & reflow soldering various QFN packages onto our customers pcb:s wi
Electronics Forum | Mon Nov 12 09:37:17 EST 2007 | russ
You need to perform process a capability study prior to putting these controls into place. Cleaning a stencil after each pass will get ugly, solvent residues remaining in apertures etc. 2D inspection is good. Change paste every hour will get very
Electronics Forum | Mon Jan 07 17:51:34 EST 2008 | jmelson
The clear plastic packaging for LEDs is a LOT softer thermoplastic than the thermoset epoxies used on ordinary chips. I think people have had high failure rates when reflowing LEDs in all-plastic packages even at SnPb temperatures, and much worse at
Electronics Forum | Mon Jan 07 09:51:39 EST 2008 | pjc
I have seen the application with hot-bar soldering machines for SOT 23 LED packages. I could not find any of the machines in my search that specially state SOT 23 packages, but you might want to check with these guys: http://www.unitekequipment.com/
Electronics Forum | Mon Nov 24 11:19:21 EST 2008 | sjones
I am having problems soldering a Rohs compliant BGA ATMEL AT91RM9200(rohs compliant board) This device recommends a soldering profile from J-STD-20 and a minimum peak package temperature of 250 centigrade,peak 260. However a lot of the other componen
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