Electronics Forum | Tue Sep 21 21:19:59 EDT 2021 | demradarmfg
Yes, and while it did, its been around longer than we have had any sort of process engineers. While the package naming scheme, or lack there of, is a mess. I am mostly curious if there is any other identifiers or naming conventions besides specific m
Electronics Forum | Wed Oct 01 16:53:05 EDT 2003 | johnpatricelli
We use Mydata PNP equipment, and are quite happy with it's speed and accuracy, especially with the latest version of the Mydata Tpsys software which includes a prototype version of their emergent auto-teach function for package sizes that can handle
Electronics Forum | Tue Aug 22 21:00:39 EDT 2006 | davef
National says: [ http://www.national.com/packaging/llp/faq.html#faq_manu ] Manufacturing FAQ's Are there any precautions that need to be taken with the LLP package? It is critical to follow National�s guidelines for successful surface moun
Electronics Forum | Tue Dec 15 17:01:36 EST 1998 | Chrys
| Does anyone know what a TCP is? | What type of process is required for assembly, what type of equipment? | | Any help or resources on the subject would be greatly appreciated.. | | Thanks | Brain, TCP, or tape carrier package is the same as TAB
Electronics Forum | Tue Oct 24 10:03:24 EDT 2006 | billyd
All - I'm hoping I can get a little feedback here on my package libraries for my Mydata machines. I have four tied to a server right now, and I have several operators that apparently like to make packages, so I have some called 0805-05-A-MY-9-2 and t
Electronics Forum | Tue Oct 24 13:07:54 EDT 2006 | CL
Hello Billy, We have 6 machines tied to a server. I can see where this would be a problem. Basically, the answer is you would need a package for every significantly different package that you are placing. I don't think you can just say 3 0805 packag
Electronics Forum | Wed Jan 23 19:44:45 EST 2008 | hegemon
In addition to the pre-emptive steps mentioned above, in my experience there are certain BGA package designs that seem more prone to that corner bridging. I have seen some packages that will essentially "curl" down at one corner as the package begin
Electronics Forum | Thu Jun 28 15:22:59 EDT 2012 | spitkis2
Would like to ask end users or those with experience using infra red rework equipment (specifically when the top heater is IR) the following: 1. Can you successfully rework Package On Package (PoP) type devices? With heat directed through the packa
Electronics Forum | Tue Sep 21 18:51:15 EDT 2021 | dem_radar_mfg
Pretty new SMT process engineer here. Context: we are using a MyData100 and using MYcenter software with it. Most package naming conventions only define outer area/foot print dimensions. However, I do not know of any convention for further package de
Electronics Forum | Fri Feb 25 05:42:17 EST 2000 | Istv�n Dominik
Hi, We should wavesolder a PLCC44 package. The PCB is under the design procedure now and we must specify the best parameters (the orientation (45 or 90 degrees) of the package on the PCB,the number, the positon and the size of the solder thief pads
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