Electronics Forum | Fri Sep 05 09:15:36 EDT 2014 | rgduval
Hi, Edri, It's not uncommon for PCB fab houses to change pad sizes like that, due to design constraints....however, it always aggravates me when they do it without checking with me first. In my mind, that's the first sign of potential bad issues wi
Electronics Forum | Wed Sep 19 14:23:31 EDT 2001 | jschake
Pad Metallurgy Used: Copper OSP pads were used for all of the results that I have been reporting. The same design test boards with Nickel/Gold pads are available and awaiting further assembly tests. I will consult with a board technology and metall
Electronics Forum | Thu Jul 08 15:38:27 EDT 1999 | Earl Moon
| Thank you all for your replies. Thanks to your replies and backup from the IPC-SM-782A (section 3.6.3.2) and James Blankenhorn's "SMT Design Rules & Standards," the designer has agreed to provide adequate clearance between the via and the pad. |
Electronics Forum | Wed Feb 23 11:02:41 EST 2000 | John
John, I'll try to take a crack at it. We manufacture our own boards, and have a high mix. We currently have BOTH a Camalot 2800 Dispenser and a DEK 260 Screen printer. We use the camalot for glue applications, and prototype paste. We use the printe
Electronics Forum | Tue Oct 24 19:40:40 EDT 2000 | Dave F
From the SMTnet Library Terms & Definitions [er whatever they call it] � Emulsion. A material that suppliers build-up on a printing screen to block portions of the screen. The un-blocked (open) portion of the screen define the pattern for depositi
Electronics Forum | Wed Feb 23 11:02:41 EST 2000 | John
John, I'll try to take a crack at it. We manufacture our own boards, and have a high mix. We currently have BOTH a Camalot 2800 Dispenser and a DEK 260 Screen printer. We use the camalot for glue applications, and prototype paste. We use the printe
Electronics Forum | Tue Aug 24 04:05:15 EDT 1999 | Scott Davies
| Hello everyone, | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advance. | | Gyve
Electronics Forum | Wed Jul 22 13:50:49 EDT 1998 | Justin Medernach
| My firm has just begun it's first PCB that will use BGA packaging. I have been reading up on the processes involved with BGAs and was wondering if you need to apply solder paste to the pads prior to applying heat and mounting the part to the board
Electronics Forum | Thu Nov 01 04:52:50 EST 2001 | wbu
Hi Brian, yes that�s possible due to the presence of Au in the joint but nothing to worry if the Ni/Au is done properly (means not to much Au in your plating). "rugged" I haven�t noticed yet, that may depend on the definition and maybe the magnifica
Electronics Forum | Fri Feb 13 12:16:05 EST 2004 | Mike Konrad
Ashok, It is most likely not the DI water that is attacking the aluminum rather it is the saponifier. DI water is only in contact with the parts for a relatively short time. If your cleaning process provides for a rapid drying cycle, you should be
