Electronics Forum: pad flow (Page 6 of 24)

Pad dissolution on Thick PCB's

Electronics Forum | Wed Apr 26 03:32:29 EDT 2006 | saaitk

Hi all, Has anyone any experience they can share with regard to pad dissolution on PTH's on thick boards. We are using lead free SAC305 on both OSP and Immersion silver finishes and are experiencing difficulties when removing and replacing connector

Reflow Oven vs 0402 Tomb Stone

Electronics Forum | Sun Jun 10 12:15:37 EDT 2001 | procon

Hello Danial, Leave it up to most to blame the relow oven for their tombstoning problems when in fact it is usually the last to cause it. The biggest culprit of tombstoning is the pad design followed by the print quality. Usually, we find that the p

Re: Defects Definition

Electronics Forum | Mon Feb 07 13:40:41 EST 2000 | Dave F

Jose: Those are good guesses. Without knowing more, ask yourself: 1 There is probably adequate heat available, but that portion of the substrate that�s not soldering well is not receiving proper heating. Why is the component getting so hot, relati

Re: 0201Technology

Electronics Forum | Wed May 10 22:53:18 EDT 2000 | Tan Kheng Beng

The Cpk collected by placement on glass boards and calibration has been done. All has been fine until we actually try on actual boards with printing. We have problems like insufficient solder due to closed aperture, improper flow of solder on the pad

BGA Aperture

Electronics Forum | Wed Jun 20 08:14:36 EDT 2007 | pavel_murtishev

Good afternoon, You should use overprint technique if you have any problems with paste volume (PIH technology and mixed designs, for instance). Otherwise, it is useless. Overprint has to be made in such way so that paste would have an ability to flo

Re: squeegee angle

Electronics Forum | Tue Apr 06 10:30:48 EDT 1999 | Scott Davies

Tony Although I agree in principle with Dean that 45 Degrees would be ideal, most of the squeegees I have worked with have been 60 Degrees to the stencil surface. This seems to work best with metal squeegees when printing HASL boards, because the sl

Solderability Issues

Electronics Forum | Tue Jul 20 15:10:00 EDT 2010 | vetteboy86

Recently we have expereinced solder issues with our reflow process. The issue is random and doesn't effect every assembly. I'm seeing extreme solder wicking, no solder flow onto the pads, only onto the leads of the components. I have tried to hand

Poor Reflow with Ground Planes for Wave Solder

Electronics Forum | Thu Aug 13 15:46:57 EDT 2020 | ironsmt

I'm having a problem getting sufficient solder reflow on a SMD part. The board design (which can't be changed) is covered in ground planes that cause a lot of uneven heat distribution. I believe heat is wicking away from the culprit part, causing t

PCB defects

Electronics Forum | Wed Dec 13 13:11:06 EST 2017 | barryg

HI all. Recently we have been experiencing some PCB defects and so far it appears on a particular pcb. Components in areas, and the areas appears to be random, have shifted, skewed components. Most of these components, it appears the solder has flowe

100% solder coverage

Electronics Forum | Wed Sep 12 22:57:02 EDT 2007 | lito_visaya

Anyone, We are an electronic assembly contractor and one of our customer requires a 100% solder coverage on pads for their products. We are using flex pcb and we mount only one component (LED for backlight application). The solder paste we are u


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